As electronic devices continue to advance in performance， thermal design has emerged as a critical bottleneck in their development. A systematic overview of the current status and challenges in thermal design technologies for electronic devices is presented in this paper. It explores key technical directions， including heat conduction， heat convection， heat radiation， thermal energy storage and microsystem cooling， and provides insights into current technical approaches， research progress and future trends. The thermal design requirements of high-power， high-integration and high-reliability electronic devices are particularly focused on in this paper， and corresponding technology selection suggestions are provided， which can provide effective solutions to electronic device thermal management. Continuous innovation in thermal design technologies will provide crucial support for the efficient， reliable and safe operation of electronic devices.

Low temperature co-fired ceramics (LTCC) possess outstanding dielectric properties， thermal stability and multi-functional integration capabilities， and have been widely applied in 5G/6G communications， millimeter-wave radars， satellite payloads and system-level packaging. However， traditional processes have two significant limitations: first， constrained by the forming methods， it's difficult to achieve high-precision fabrication of curved multi-layer substrates;second， the complex process flows and strong dependence on batch scale make it difficult to meet the rapid verification requirment for single-piece and small-batch substrates. Additive manufacturing， based on the unique technical path of layer-by-layer stacking and on-demand deposition， provides an innovative solution to break through the above bottlenecks. In this paper， the research trends in material preparation and forming processes involved in LTCC additive manufacturing are systematically reviewed， the existing key issues are analyzed in depth， and the future development directions are prospected.

As an integration product of new intelligent ammunition and unmanned aerial vehicle (UAV) technology， loitering munitions are reshaping the form of modern warfare. In this paper the current development status of loitering munitions both at home and abroad is reviewed. Typical combat modes and application scenarios for loitering munitions are summarized. Design elements are discussed from multiple aspects including classification of loitering munitions， structural composition， main development content and core elements. Development directions are pointed out for key technological bottlenecks such as platform design， precision strike， integrated launch， anti-jamming communication， swarm coordination， etc. This study provides a reference for future development and application of loitering munitions.

The shear deformation and fracture behavior of Cu-Sn intermetallic compound (IMC) joints with different thicknesses of Cu₃Sn phases without current (0 A/cm²) and with current (3×10² A/cm²) stressing are studied in this paper. The results show that: whether under current stressing or not， the equivalent modulus and shear strength of the joints increase with the increase of Cu₃Sn phase thickness， and the maximum strength is 89.1 MPa (0 A/cm²) and 83.2 MPa (3×10² A/cm²) respectively; the equivalent modulus and shear strength of the joints decrease under current stressing， and the decrease rate decreases with the increase of Cu₃Sn phase thickness， which indicates that Cu₃Sn phase has better current resistance than Cu₆Sn₅ phase; with the increase of Cu₃Sn phase thickness， the fracture (a brittle fracture) position of the joints gradually changes from Cu₆Sn₅ phase to the phase interface between Cu₆Sn₅ and Cu₃Sn and finally in the Cu₃Sn phase whether under current stressing or not. These research results provide necessary data support and theoretical support for the accurate evaluation of the reliability of Cu-Sn IMC joints.

The laser interferometry measurement system is a non-destructive measurement system with high accuracy. However， when it is utilized to measure the bearing ball， the deviation is introduced unavoidably in the positioning accuracy of the bearing ball to be measured. This deviation conceals the real surface error of the bearing ball， which makes it difficult to guarantee the measurement accuracy of bearing ball. Based on the existing laser interferometry measurement system， a virtual wavefront calibration method is proposed to measure the bearing ball in this paper. With the ray tracing method， the virtual wavefront is generated to compensate the positioning error without any additional component in order to ensure the accuracy of the interferometric measurement system. The experiments show that the maximum positioning error of this measurement system is not more than λ/40 (peak to valley) and λ/80 (root mean square) (λ is the wavelength of measuring light propagation in a vacuum condition)， which verifies the effectiveness of this method and this measurement system.

A collaborative design method of topology optimization and response surface optimization is proposed to meet the lightweight requirements of the structural shell of aerospace electronic devices. Based on the impact response spectrum， the topology design is completed using the variable density method and the mass of structural shell is reduced by 28.1%. A Kriging surrogate model is established to solve the issue of stress concentration in the support ears after topology design. Multi-objective genetic algorithm is used to optimize parameters such as wall thickness， height of the support ear and fillet radius at the connection of the support ears. As a result， the shell mass is reduced by 21.1% compared to the initial design， the maximum equivalent stress is reduced by 0.38% and the engineering requirement of a safety factor (≥1.5) is satisfied. This method takes into account both global and local optimization through a two-stage optimization strategy， which provides an efficient and highly precise solution to lightweight design of aerospace electronic devices under impact loads.

With the development of radar towards high integration， high power， multi-function， etc.， the antenna structure faces many challenges， such as high integration design， lightweight design， power resistance design and electromagnetic shielding design. Among them， with the increase of power and requirements of multiple functions (detection， jamming， reconnaissance， communication， attack， etc.)， the electromagnetic shielding structure design is becoming more and more important. In this paper aiming at the strict electromagnetic shielding effectiveness requirements of a high power radar system with detection and attack functions， according to the structural characteristics of antenna array， the electromagnetic shielding design of antenna is researched in detail from shielding effectiveness distribution， telecommunication basis of shielding design， shielding material selection， electromagnetic shielding design of slot and hole structure， etc. The design strategy for improving the relevant shielding effectiveness of structure is verified to be effective by engineering tests.

Aiming at the difficult problem that the existing ballistic telemetry antenna turntable system is required to configure telemetry antennas with different received powers according to the target types， the lightweight medium-sized ballistic telemetry antenna which is easy to maintain is proposed. Elevation-azimuth type is selected for the turntable system. A mechanism for pitch axis is designed to disassemble the drive shaft from the transmission lugs without disassembling the antenna array， which adopts the shaft-locking to ensure the transmission accuracy and improve the disassembly and maintenance efficiency of the transmission system. In addition， an azimuth transmission mechanism with an adjustable center is designed for the azimuth axis. This mechanism not only improves the antenna pointing accuracy by reducing the gear gap but also realizes in-site adjustment， which greatly reduces the disassembly and maintenance difficulty at site. The telemetry antenna with pitch axis accuracy of 0.4° and azimuth axis accuracy of 0.03° meets the preset accuracy requirement and has been delivered for use， which shows excellent antenna telemetry tracking performance and provides a reference for the structure design of the other ballistic telemetry antenna.

To address the bottleneck in thermal dissipation capacity of traditional aluminum alloy heat sinks， a sandwich-structured graphite-aluminum composite is proposed in this paper. Comparative experiments demonstrate its superior lateral heat dissipation to aluminum alloys. Based on the established simulation model， a semi-physical calibration method is employed to quantify both in-plane and through-plane thermal conductivities of the graphite layer and composite. The results reveal that the graphite-aluminum composite with in-plane thermal conductivity of 390 W/(m·K) has copper-equivalent heat dissipation performance and its density is much lower than that of copper， demonstrating substantial advantages for aerospace lightweight engineering. The quantified thermal parameters enable thermal designers to efficiently develop optimized heat dissipation solutions through simulation-driven design iterations.