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A Study on Influence of Cu3Sn Phase Thickness on Shear Performance of Cu-Sn IMC Joint
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Bo WANG1, 2, Guanglong RAN2, Ming LIU3, Kaixuan HE1, Jian ZHANG2, Wei HUANG2, Kailin PAN2
Electro-Mechanical Engineering | 2025, 41(5) : 40 - 46
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Electro-Mechanical Engineering | 2025, 41(5): 40-46
• Young Scholar Forum •
A Study on Influence of Cu3Sn Phase Thickness on Shear Performance of Cu-Sn IMC Joint
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Bo WANG1, 2, Guanglong RAN2, Ming LIU3, Kaixuan HE1, Jian ZHANG2, Wei HUANG2, Kailin PAN2
Affiliations
  • 1East China Institute of Photo-Electron IC, Bengbu 233042, China
  • 2Guilin University of Electronic Technology, Guilin 541004, China
  • 3Hubei Sanjiang Aerospace RedPeak Control Co., Ltd., Xiaogan 432000, China
doi: 10.19659/j.issn.1008-5300.20250614066
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The shear deformation and fracture behavior of Cu-Sn intermetallic compound (IMC) joints with different thicknesses of Cu3Sn phases without current (0 A/cm2) and with current (3×102 A/cm2) stressing are studied in this paper. The results show that: whether under current stressing or not， the equivalent modulus and shear strength of the joints increase with the increase of Cu3Sn phase thickness， and the maximum strength is 89.1 MPa (0 A/cm2) and 83.2 MPa (3×102 A/cm2) respectively; the equivalent modulus and shear strength of the joints decrease under current stressing， and the decrease rate decreases with the increase of Cu3Sn phase thickness， which indicates that Cu3Sn phase has better current resistance than Cu6Sn5 phase; with the increase of Cu3Sn phase thickness， the fracture (a brittle fracture) position of the joints gradually changes from Cu6Sn5 phase to the phase interface between Cu6Sn5 and Cu3Sn and finally in the Cu3Sn phase whether under current stressing or not. These research results provide necessary data support and theoretical support for the accurate evaluation of the reliability of Cu-Sn IMC joints.

Cu-Sn intermetallic compound (IMC) joint  /  Cu3Sn phase  /  current stressing  /  shear performance  /  fracture behavior
Bo WANG, Guanglong RAN, Ming LIU, Kaixuan HE, Jian ZHANG, Wei HUANG, Kailin PAN. A Study on Influence of Cu3Sn Phase Thickness on Shear Performance of Cu-Sn IMC Joint[J]. Electro-Mechanical Engineering, 2025 , 41 (5) : 40 -46 . DOI: 10.19659/j.issn.1008-5300.20250614066
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doi: 10.19659/j.issn.1008-5300.20250614066
  • Receive Date：2025-06-14
  • Online Date：2026-04-17
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  • Received：2025-06-14
Affiliations
    1East China Institute of Photo-Electron IC, Bengbu 233042, China
    2Guilin University of Electronic Technology, Guilin 541004, China
    3Hubei Sanjiang Aerospace RedPeak Control Co., Ltd., Xiaogan 432000, China
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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