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A Review on Additive Manufacturing of Low Temperature Co-fired Ceramics
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Jin HUANG, Yunna PU, Chaoyu LIANG
Electro-Mechanical Engineering | 2025, 41(5) : 27 - 33
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Electro-Mechanical Engineering | 2025, 41(5): 27-33
• Expert Forum •
A Review on Additive Manufacturing of Low Temperature Co-fired Ceramics
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Jin HUANG, Yunna PU, Chaoyu LIANG
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  • State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China
doi: 10.19659/j.issn.1008-5300.20250911001
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Low temperature co-fired ceramics (LTCC) possess outstanding dielectric properties， thermal stability and multi-functional integration capabilities， and have been widely applied in 5G/6G communications， millimeter-wave radars， satellite payloads and system-level packaging. However， traditional processes have two significant limitations: first， constrained by the forming methods， it's difficult to achieve high-precision fabrication of curved multi-layer substrates;second， the complex process flows and strong dependence on batch scale make it difficult to meet the rapid verification requirment for single-piece and small-batch substrates. Additive manufacturing， based on the unique technical path of layer-by-layer stacking and on-demand deposition， provides an innovative solution to break through the above bottlenecks. In this paper， the research trends in material preparation and forming processes involved in LTCC additive manufacturing are systematically reviewed， the existing key issues are analyzed in depth， and the future development directions are prospected.

low temperature co-fired ceramics  /  additive manufacturing  /  material preparation  /  forming process
Jin HUANG, Yunna PU, Chaoyu LIANG. A Review on Additive Manufacturing of Low Temperature Co-fired Ceramics[J]. Electro-Mechanical Engineering, 2025 , 41 (5) : 27 -33 . DOI: 10.19659/j.issn.1008-5300.20250911001
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Year 2025 volume 41 Issue 5
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doi: 10.19659/j.issn.1008-5300.20250911001
  • Receive Date：2025-09-11
  • Online Date：2026-04-17
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  • Received：2025-09-11
Affiliations
    State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China
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多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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