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Lightweight Design of Electronic Device Shell Based on Topology-Response Surface Collaboration
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Hang LI, Qingping JIA, Yong QIN
Electro-Mechanical Engineering | 2025, 41(5) : 54 - 61
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Electro-Mechanical Engineering | 2025, 41(5): 54-61
• Structure Design •
Lightweight Design of Electronic Device Shell Based on Topology-Response Surface Collaboration
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Hang LI, Qingping JIA, Yong QIN
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  • Beijing Institute of Computer Technology and Applications, Beijing 100854, China
doi: 10.19659/j.issn.1008-5300.20250525049
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A collaborative design method of topology optimization and response surface optimization is proposed to meet the lightweight requirements of the structural shell of aerospace electronic devices. Based on the impact response spectrum， the topology design is completed using the variable density method and the mass of structural shell is reduced by 28.1%. A Kriging surrogate model is established to solve the issue of stress concentration in the support ears after topology design. Multi-objective genetic algorithm is used to optimize parameters such as wall thickness， height of the support ear and fillet radius at the connection of the support ears. As a result， the shell mass is reduced by 21.1% compared to the initial design， the maximum equivalent stress is reduced by 0.38% and the engineering requirement of a safety factor (≥1.5) is satisfied. This method takes into account both global and local optimization through a two-stage optimization strategy， which provides an efficient and highly precise solution to lightweight design of aerospace electronic devices under impact loads.

structural lightweight  /  topology optimization  /  response surface optimization  /  shock response spectrum  /  Kriging model
Hang LI, Qingping JIA, Yong QIN. Lightweight Design of Electronic Device Shell Based on Topology-Response Surface Collaboration[J]. Electro-Mechanical Engineering, 2025 , 41 (5) : 54 -61 . DOI: 10.19659/j.issn.1008-5300.20250525049
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Year 2025 volume 41 Issue 5
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doi: 10.19659/j.issn.1008-5300.20250525049
  • Receive Date：2025-05-25
  • Online Date：2026-04-17
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  • Received：2025-05-25
Affiliations
    Beijing Institute of Computer Technology and Applications, Beijing 100854, China
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多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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