Previous Issues
Year 2022, volume 1, Issue 3

Review and Commentary

Development of Integrated Circuit Industrial Technologies in the Post-Moore Era

Weihai BU, Zhiliang XIA, Zhiguo ZHAO, Yun LIU, Yikang ZHOU

2022 Vol. 1(3): 20-41.

doi: 10.3981/j.issn.2097-0781.2022.03.002

Reading ( 1704 ) PDF ( 1113 )

Review and Commentary

Evolution of Advanced CMOS Technology and Suggestions for Its Development in China

Wei ZHANG, Min XU, Kun CHEN, Tao LIU, Jingwen YANG, Xin SUN, Ziqiang HUANG, Dawei WANG, Chunlei WU, Chen WANG, Saisheng XU

2022 Vol. 1(3): 52-60.

doi: 10.3981/j.issn.2097-0781.2022.03.004

Reading ( 1656 ) PDF ( 1754 )

Review and Commentary

Current Situation and Development Trend of Core Process Equipment Technologies for Integrated Circuit

Jinrong ZHAO, Gang WEI, Jue HOU, Yongyou CAO, Jinwei DONG, Xisheng LU, Wei SUN

2022 Vol. 1(3): 61-72.

doi: 10.3981/j.issn.2097-0781.2022.03.005

Reading ( 1652 ) PDF ( 5310 )

Review and Commentary

Development Status and Trend of EDA and IP Core Industries

Weiping LIU, Zongyuan WANG

2022 Vol. 1(3): 90-100.

doi: 10.3981/j.issn.2097-0781.2022.03.008

Reading ( 1057 ) PDF ( 1405 )

Review and Commentary

Development and Opportunity of Advanced Packaging Technology

Liqiang CAO, Fengze HOU, Qidong WANG, Fengman LIU, Jun LI, Fei DING, Siwei SUN, Yunyan ZHOU

2022 Vol. 1(3): 101-114.

doi: 10.3981/j.issn.2097-0781.2022.03.009

Reading ( 2790 ) PDF ( 2418 )

Review and Commentary

Future Technical Development Approach for High Computing Power Chips

Peng YAO, Changming SONG, Yang HU, Jian CAI, Shouyi YIN, Huaqiang WU

2022 Vol. 1(3): 115-129.

doi: 10.3981/j.issn.2097-0781.2022.03.010

Reading ( 2380 ) PDF ( 9507 )

Review and Commentary

Device Technology in Post-Moore Era: Research Progress and Future Trends

Peijian WANG, Jiachao ZHOU, Jiayang HU, Hanxi LI, Feng TIAN, Zhixiang ZHANG, Jian CHAI, Xinyi XU, Zheng BIAN, Yuda ZHAO, Yang XU, Bin YU

2022 Vol. 1(3): 130-145.

doi: 10.3981/j.issn.2097-0781.2022.03.011

Reading ( 1104 ) PDF ( 1219 )