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Integrated circuit (IC) equipment is essential in the industrial chain of IC, the industry of which features high technical thresholds. This paper analyzes its industry development status both at home and abroad, the development trends of its core process equipment technologies, and the challenges faced by technologies of its key matching parts. On this basis, the problems and pain points of China’s IC equipment industry are explored to predict the development trends of the industry and its technologies. Finally, measures and suggestions are proposed for the development of China’s IC equipment industry under this background.

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集成电路装备产业是集成电路产业链的重要组成部分,拥有极高的技术门槛。文章从分析国内外集成电路装备产业的发展现状、核心工艺装备技术的发展趋势及配套关键部件技术面临的挑战等方面入手,剖析中国集成电路装备产业的问题与痛点,探求产业和技术的发展趋势,进而对中国集成电路装备产业在此背景下的发展提出对策与建议。

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赵晋荣,教授级高级工程师。现任北方华创科技集团股份有限公司/北京北方华创微电子装备有限公司董事长、CEO。长期致力于高端集成电路设备开发及产业化应用。作为项目负责人多次主持国家科技重大专项02专项和国家“863”计划,从无到有,从有到优,自主研制多代刻蚀、PVD、CVD等装备。入选“国家百千万人才工程”“北京学者计划”等。获国家科学技术进步奖二等奖、北京市科学技术奖一等奖等。电子信箱:

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赵晋荣,教授级高级工程师。现任北方华创科技集团股份有限公司/北京北方华创微电子装备有限公司董事长、CEO。长期致力于高端集成电路设备开发及产业化应用。作为项目负责人多次主持国家科技重大专项02专项和国家“863”计划,从无到有,从有到优,自主研制多代刻蚀、PVD、CVD等装备。入选“国家百千万人才工程”“北京学者计划”等。获国家科学技术进步奖二等奖、北京市科学技术奖一等奖等。电子信箱:

"}, bioImg=NA+TgIBneO5btX0gaOZqhg==, bioContent=

赵晋荣,教授级高级工程师。现任北方华创科技集团股份有限公司/北京北方华创微电子装备有限公司董事长、CEO。长期致力于高端集成电路设备开发及产业化应用。作为项目负责人多次主持国家科技重大专项02专项和国家“863”计划,从无到有,从有到优,自主研制多代刻蚀、PVD、CVD等装备。入选“国家百千万人才工程”“北京学者计划”等。获国家科学技术进步奖二等奖、北京市科学技术奖一等奖等。电子信箱:

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ZEISS:蔡司;MKS:万机仪器;Edwards:爱德华;AE:优仪半导体;Horiba:堀场;VAT:微拓半导体;Ichor:艾科尔;UCT:超科林;ASML:阿斯麦;EBARA:荏原机械。

, figureFileSmall=eJYcCQChz99KeD91jU3U5g==, figureFileBig=MGDlogoGDeg1vmMD1k+6Fg==, tableContent=null), ArticleFig(id=1241718798454149131, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718777285497764, language=EN, label=null, caption=null, figureFileSmall=null, figureFileBig=null, tableContent=
总排名 装备厂商
1 应用材料(AMAT)
2 阿斯麦(ASML)
3 东电电子(TEL)
4 泛林半导体(LAM)
5 科磊半导体(KLA)
6 细美事(SEMES)
7 迪恩士(DNS)
8 科意半导体(KE)
9 先晶半导体(ASM)
10 村田机械(Murata)
), ArticleFig(id=1241718798512869388, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718777285497764, language=CN, label=表1, caption=

2021年全球前10集成电路装备厂商营业收入排名

, figureFileSmall=null, figureFileBig=null, tableContent=
总排名 装备厂商
1 应用材料(AMAT)
2 阿斯麦(ASML)
3 东电电子(TEL)
4 泛林半导体(LAM)
5 科磊半导体(KLA)
6 细美事(SEMES)
7 迪恩士(DNS)
8 科意半导体(KE)
9 先晶半导体(ASM)
10 村田机械(Murata)
), ArticleFig(id=1241718798680641549, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718777285497764, language=EN, label=null, caption=null, figureFileSmall=null, figureFileBig=null, tableContent=
厂商 主营品类
大和集团 精密金属、陶瓷、石英、硅
沈阳富创 精密金属
肯发高精 精密金属
昆山新莱 精密金属、阀门管件
靖江先锋 精密金属
苏州珂玛 陶瓷
沈阳贺利氏 石英
七星流量计 质量流量计
托伦斯 精密金属
沈阳新松 半导体设备前端模块、机械手
), ArticleFig(id=1241718798768721934, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718777285497764, language=CN, label=表2, caption=

中国大陆主要关键零部件厂商及其主营品类

, figureFileSmall=null, figureFileBig=null, tableContent=
厂商 主营品类
大和集团 精密金属、陶瓷、石英、硅
沈阳富创 精密金属
肯发高精 精密金属
昆山新莱 精密金属、阀门管件
靖江先锋 精密金属
苏州珂玛 陶瓷
沈阳贺利氏 石英
七星流量计 质量流量计
托伦斯 精密金属
沈阳新松 半导体设备前端模块、机械手
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Current Situation and Development Trend of Core Process Equipment Technologies for Integrated Circuit
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Jinrong ZHAO , Gang WEI , Jue HOU , Yongyou CAO , Jinwei DONG , Xisheng LU , Wei SUN
Science and Technology Foresight | Review and Commentary 2022,1(3): 61-72
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Science and Technology Foresight | Review and Commentary 2022, 1(3): 61-72
Current Situation and Development Trend of Core Process Equipment Technologies for Integrated Circuit
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Jinrong ZHAO , Gang WEI, Jue HOU, Yongyou CAO, Jinwei DONG, Xisheng LU, Wei SUN
Authors
  • Beijing NAURA Microelectronics Equipment Co., Ltd., Beijing 100176, China

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Current Situation and Development Trend of Core Process Equipment Technologies for Integrated Circuit
Jinrong ZHAO , Gang WEI, Jue HOU, Yongyou CAO, Jinwei DONG, Xisheng LU, Wei SUN
Affiliations
  • Beijing NAURA Microelectronics Equipment Co., Ltd., Beijing 100176, China
Published: 2022-09-20 doi: 10.3981/j.issn.2097-0781.2022.03.005
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Integrated circuit (IC) equipment is essential in the industrial chain of IC, the industry of which features high technical thresholds. This paper analyzes its industry development status both at home and abroad, the development trends of its core process equipment technologies, and the challenges faced by technologies of its key matching parts. On this basis, the problems and pain points of China’s IC equipment industry are explored to predict the development trends of the industry and its technologies. Finally, measures and suggestions are proposed for the development of China’s IC equipment industry under this background.

integrated circuit  /  equipment fabrication industry  /  core process equipment

Integrated circuit (IC) equipment is essential in the industrial chain of IC, the industry of which features high technical thresholds. This paper analyzes its industry development status both at home and abroad, the development trends of its core process equipment technologies, and the challenges faced by technologies of its key matching parts. On this basis, the problems and pain points of China’s IC equipment industry are explored to predict the development trends of the industry and its technologies. Finally, measures and suggestions are proposed for the development of China’s IC equipment industry under this background.

integrated circuit  /  equipment fabrication industry  /  core process equipment
赵晋荣, 韦刚, 侯珏, 曹永友, 董金卫, 卢夕生, 孙伟. 集成电路核心工艺装备技术的现状与展望[J]. 前瞻科技, 2022 , 1 (3) : 10 -148 . DOI: 10.3981/j.issn.2097-0781.2022.03.005
Jinrong ZHAO, Gang WEI, Jue HOU, Yongyou CAO, Jinwei DONG, Xisheng LU, Wei SUN. Current Situation and Development Trend of Core Process Equipment Technologies for Integrated Circuit[J]. Science and Technology Foresight, 2022 , 1 (3) : 10 -148 . DOI: 10.3981/j.issn.2097-0781.2022.03.005
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doi: 10.3981/j.issn.2097-0781.2022.03.005
  • Received:2022-06-16
  • Published:2022-09-20
  • Release:2022-11-04
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  • 收稿日期:2022-06-16
  • 修回日期:2022-08-26
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    Beijing NAURA Microelectronics Equipment Co., Ltd., Beijing 100176, China

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赵晋荣, 韦刚, 侯珏, 曹永友, 董金卫, 卢夕生, 孙伟. 集成电路核心工艺装备技术的现状与展望[J]. 前瞻科技, 2022 , 1 (3) : 10 -148 . DOI: 10.3981/j.issn.2097-0781.2022.03.005
Jinrong ZHAO, Gang WEI, Jue HOU, Yongyou CAO, Jinwei DONG, Xisheng LU, Wei SUN. Current Situation and Development Trend of Core Process Equipment Technologies for Integrated Circuit[J]. Science and Technology Foresight, 2022 , 1 (3) : 10 -148 . DOI: 10.3981/j.issn.2097-0781.2022.03.005
表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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