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Integrated circuits (ICs) are the basis of the information industry and play an important role in social and economic development. To systematically understand the innovation and development of IC in China and overcome the major challenges of research and development (R & D) and coordinated development in the new era, we collate the development status of global IC and analyze the technology development trends and the global cooperation among major R & D organizations by the bibliometric method. It is found that leading IC enterprises are the main entities of technology innovation in this field, and they form a lateral cooperation mode. Meanwhile, large-scale R & D centers with enterprises or research institutes at the core play a critical role in developing key general-purpose technology, and they present the cooperation and development trends of coexisted globalization and regionalization. Moreover, relevant policy and development suggestions are put forward given the R & D status in China’s IC and the construction status of national strategic science and technology forces.
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集成电路是信息产业的基础,在社会经济发展等方面发挥了重要的作用。为系统了解中国集成电路技术创新发展情况,并应对新时期技术研发与协同发展的重大挑战,文章通过文献计量等方法,对全球集成电路技术发展现状进行初步梳理,分析了技术发展趋势和主要研发力量分工合作现状。研究结果表明,在集成电路领域,领军企业是技术创新的主体,构建了以横向水平联合为主的分工模式;以企业或科研机构等为核心组成的大型研发中心承担了重要的关键共性技术研发功能,同时呈现出全球化和区域化并存的合作发展态势。最后还结合中国集成电路领域技术研发和国家战略科技力量建设需求,提出了相关的政策和发展建议。
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 |
王文武,研究员,博士研究生导师。现任中国科学院微电子研究所副所长。长期致力于集成电路先导工艺与器件技术研究,带领团队参与了22、14、5 nm工艺的集成电路先导技术研发。主持多项国家科技重大专项项目（课题）等国家级科研任务。获中国科学院杰出科技成就奖、北京市科学技术奖一等奖、中国电子信息科技创新团队奖、国务院政府特殊津贴等科技奖励和荣誉。在集成电路领域国际权威期刊/会议上发表论文200余篇,获授权发明专利93项。电子信箱： wangwenwu@ime.ac.cn。 |
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王文武,研究员,博士研究生导师。现任中国科学院微电子研究所副所长。长期致力于集成电路先导工艺与器件技术研究,带领团队参与了22、14、5 nm工艺的集成电路先导技术研发。主持多项国家科技重大专项项目（课题）等国家级科研任务。获中国科学院杰出科技成就奖、北京市科学技术奖一等奖、中国电子信息科技创新团队奖、国务院政府特殊津贴等科技奖励和荣誉。在集成电路领域国际权威期刊/会议上发表论文200余篇,获授权发明专利93项。电子信箱： wangwenwu@ime.ac.cn。
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王文武,研究员,博士研究生导师。现任中国科学院微电子研究所副所长。长期致力于集成电路先导工艺与器件技术研究,带领团队参与了22、14、5 nm工艺的集成电路先导技术研发。主持多项国家科技重大专项项目（课题）等国家级科研任务。获中国科学院杰出科技成就奖、北京市科学技术奖一等奖、中国电子信息科技创新团队奖、国务院政府特殊津贴等科技奖励和荣誉。在集成电路领域国际权威期刊/会议上发表论文200余篇,获授权发明专利93项。电子信箱： wangwenwu@ime.ac.cn。
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2020 IEEE International Electron Devices Meeting (IEDM). Piscataway: IEEE Press,
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10.1109/IEDM13553.2020.9372023., articleTitle=Future logic scaling: Towards atomic channels and deconstructed chips, refAbstract=null)], funds=null, companyList=[AuthorCompany(id=1241718235435954790, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718216150536513, xref=null, ext=[AuthorCompanyExt(id=1241718235440149095, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718216150536513, companyId=1241718235435954790, language=EN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=Institute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, China), AuthorCompanyExt(id=1241718235448537704, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718216150536513, companyId=1241718235435954790, language=CN, country=null, province=null, city=null, postcode=null, companyName=null, departmentName=null, remark=中国科学院微电子研究所,北京 100029)])], figs=[ArticleFig(id=1241718240079049348, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718216150536513, language=EN, label=null, caption=null, figureFileSmall=H3lm+fYoVraT/7EKJ/tHYQ==, figureFileBig=TJYAFercElRFgGM6Tn/WNw==, tableContent=null), ArticleFig(id=1241718240217461381, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718216150536513, language=CN, label=图1, caption=
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近5年发表文章按国家（地区）统计 图中仅列出发表文章数量最多的6个国家（地区）。
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主要国家（地区）的3类机构发文占比 国家（地区）
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IMEC合作机构按国家（地区）（a）和机构性质（b）统计, figureFileSmall=+A2RHSErpUUa7Vf6QXVSvw==, figureFileBig=xpY085wkNW9q56PXKxd5Xg==, tableContent=null), ArticleFig(id=1241718240800469644, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718216150536513, language=EN, label=null, caption=null, figureFileSmall=+XHa9sx8OBi1TLy/4dOjjQ==, figureFileBig=6CcaVsTGZVx0dwEE18uoOg==, tableContent=null), ArticleFig(id=1241718240859189901, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718216150536513, language=CN, label=图5, caption=
2006年和2016年中国高校研发经费来源比较, figureFileSmall=+XHa9sx8OBi1TLy/4dOjjQ==, figureFileBig=6CcaVsTGZVx0dwEE18uoOg==, tableContent=null), ArticleFig(id=1241718240930493070, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718216150536513, language=EN, label=null, caption=null, figureFileSmall=null, figureFileBig=null, tableContent=
| 序号 | 机构名称 | 机构性质 | 所在国家（地区） | 年均增加量/（篇 • a-1） |
| 1 | 三星电子 | 领军企业 | 韩国 | 5.8 |
| 2 | 英特尔 | 领军企业 | 美国 | 3.8 |
| 3 | IMEC | 科研机构 | 比利时 | 2.5 |
| 4 | 中国科学院微电子研究所 | 科研机构 | 中国大陆 | 2.5 |
| 5 | 韩国科学技术院 | 研究型大学 | 韩国 | 2.2 |
| 6 | 东京大学 | 研究型大学 | 日本 | 1.7 |
| 7 | 新加坡国立大学 | 研究型大学 | 新加坡 | 1.2 |
| 8 | 铠侠 | 领军企业 | 日本 | 1.1 |
| …… | | | |
| 51 | 赛灵思 | 领军企业 | 美国 | -1.1 |
| 52 | 得克萨斯大学 | 研究型大学 | 美国 | -1.2 |
| 53 | 香港科技大学 | 研究型大学 | 中国香港 | -1.2 |
| 54 | 格罗方德 | 领军企业 | 美国 | -2.4 |
| 55 | 密歇根大学 | 研究型大学 | 美国 | -2.7 |
| 56 | CEA-Leti | 科研机构 | 法国 | -2.9 |
| 57 | IBM | 领军企业 | 美国 | -4.0 |
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第一完成机构按年均增加量排序情况
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| 序号 | 机构名称 | 机构性质 | 所在国家（地区） | 年均增加量/（篇 • a-1） |
| 1 | 三星电子 | 领军企业 | 韩国 | 5.8 |
| 2 | 英特尔 | 领军企业 | 美国 | 3.8 |
| 3 | IMEC | 科研机构 | 比利时 | 2.5 |
| 4 | 中国科学院微电子研究所 | 科研机构 | 中国大陆 | 2.5 |
| 5 | 韩国科学技术院 | 研究型大学 | 韩国 | 2.2 |
| 6 | 东京大学 | 研究型大学 | 日本 | 1.7 |
| 7 | 新加坡国立大学 | 研究型大学 | 新加坡 | 1.2 |
| 8 | 铠侠 | 领军企业 | 日本 | 1.1 |
| …… | | | |
| 51 | 赛灵思 | 领军企业 | 美国 | -1.1 |
| 52 | 得克萨斯大学 | 研究型大学 | 美国 | -1.2 |
| 53 | 香港科技大学 | 研究型大学 | 中国香港 | -1.2 |
| 54 | 格罗方德 | 领军企业 | 美国 | -2.4 |
| 55 | 密歇根大学 | 研究型大学 | 美国 | -2.7 |
| 56 | CEA-Leti | 科研机构 | 法国 | -2.9 |
| 57 | IBM | 领军企业 | 美国 | -4.0 |
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| 技术类别 | 序号 | 机构名称 | 机构性质 | 所在国家（地区） | 文章占比/% |
| 先进逻辑及新型计算技术 | 1 | IMEC | 科研机构 | 比利时 | 15.6 |
| 2 | IBM | 领军企业 | 美国 | 9.0 |
| 3 | CEA-Leti | 科研机构 | 法国 | 5.7 |
| 存储技术 | 1 | 三星 | 领军企业 | 韩国 | 9.9 |
| 2 | IMEC | 科研机构 | 比利时 | 8.2 |
| 3 | 台积电 | 领军企业 | 中国台湾 | 6.3 |
| 工艺及先进集成和封装技术 | 1 | 英特尔 | 领军企业 | 美国 | 11.4 |
| 2 | IMEC | 科研机构 | 比利时 | 10.0 |
| 3 | 台积电 | 领军企业 | 中国台湾 | 9.0 |
| 机器学习技术 | 1 | IBM | 领军企业 | 美国 | 8.4 |
| 2 | 清华大学 | 研究型大学 | 中国大陆 | 8.4 |
| 3 | 韩国科学技术院 | 研究型大学 | 韩国 | 5.8 |
), ArticleFig(id=1241718242541105809, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718216150536513, language=CN, label=表2, caption=
先进逻辑及新型计算技术等领域的代表性机构
, figureFileSmall=null, figureFileBig=null, tableContent=
| 技术类别 | 序号 | 机构名称 | 机构性质 | 所在国家（地区） | 文章占比/% |
| 先进逻辑及新型计算技术 | 1 | IMEC | 科研机构 | 比利时 | 15.6 |
| 2 | IBM | 领军企业 | 美国 | 9.0 |
| 3 | CEA-Leti | 科研机构 | 法国 | 5.7 |
| 存储技术 | 1 | 三星 | 领军企业 | 韩国 | 9.9 |
| 2 | IMEC | 科研机构 | 比利时 | 8.2 |
| 3 | 台积电 | 领军企业 | 中国台湾 | 6.3 |
| 工艺及先进集成和封装技术 | 1 | 英特尔 | 领军企业 | 美国 | 11.4 |
| 2 | IMEC | 科研机构 | 比利时 | 10.0 |
| 3 | 台积电 | 领军企业 | 中国台湾 | 9.0 |
| 机器学习技术 | 1 | IBM | 领军企业 | 美国 | 8.4 |
| 2 | 清华大学 | 研究型大学 | 中国大陆 | 8.4 |
| 3 | 韩国科学技术院 | 研究型大学 | 韩国 | 5.8 |
), ArticleFig(id=1241718242612408978, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718216150536513, language=EN, label=null, caption=null, figureFileSmall=null, figureFileBig=null, tableContent=
| 技术类别 | 序号 | 机构名称 | 机构性质 | 所在国家（地区） | 文章占比/% |
| FinFET技术 | 1 | IMEC | 科研机构 | 比利时 | 18.2 |
| 2 | 三星 | 领军企业 | 韩国 | 13.6 |
| 3 | IBM | 领军企业 | 美国 | 9.1 |
| GAA器件技术 | 1 | IMEC | 科研机构 | 比利时 | 25.0 |
| 2 | IBM | 领军企业 | 美国 | 13.5 |
| 3 | 台湾大学 | 研究型大学 | 中国台湾 | 17.3 |
| 高迁移率沟道技术 | 1 | IBM | 领军企业 | 美国 | 16.7 |
| 2 | 麻省理工学院 | 研究型大学 | 美国 | 14.3 |
| 3 | 东京大学 | 研究型大学 | 日本 | 13.1 |
| 二维材料技术 | 1 | IMEC | 科研机构 | 比利时 | 13.5 |
| 2 | 台积电 | 领军企业 | 中国台湾 | 13.5 |
| 低功耗器件技术 | 1 | IBM | 领军企业 | 美国 | 10.7 |
| 2 | 台湾阳明交通大学 | 研究型大学 | 中国台湾 | 8.9 |
| 3 | 台湾半导体研究中心 | 科研机构 | 中国台湾 | 8.9 |
| CFET器件技术 | 1 | IMEC | 科研机构 | 比利时 | 38.5 |
| 2 | CEA-Leti | 科研机构 | 法国 | 30.8 |
| 量子器件技术 | 1 | CEA-Leti | 科研机构 | 法国 | 17.5 |
| 2 | IMEC | 科研机构 | 比利时 | 11.1 |
| 3 | 代尔夫特理工大学 | 研究型大学 | 荷兰 | 11.1 |
), ArticleFig(id=1241718242696295059, tenantId=1146029695717560320, journalId=1146032081894723586, articleId=1241718216150536513, language=CN, label=表3, caption=
FinFET技术等领域的代表性机构
, figureFileSmall=null, figureFileBig=null, tableContent=
| 技术类别 | 序号 | 机构名称 | 机构性质 | 所在国家（地区） | 文章占比/% |
| FinFET技术 | 1 | IMEC | 科研机构 | 比利时 | 18.2 |
| 2 | 三星 | 领军企业 | 韩国 | 13.6 |
| 3 | IBM | 领军企业 | 美国 | 9.1 |
| GAA器件技术 | 1 | IMEC | 科研机构 | 比利时 | 25.0 |
| 2 | IBM | 领军企业 | 美国 | 13.5 |
| 3 | 台湾大学 | 研究型大学 | 中国台湾 | 17.3 |
| 高迁移率沟道技术 | 1 | IBM | 领军企业 | 美国 | 16.7 |
| 2 | 麻省理工学院 | 研究型大学 | 美国 | 14.3 |
| 3 | 东京大学 | 研究型大学 | 日本 | 13.1 |
| 二维材料技术 | 1 | IMEC | 科研机构 | 比利时 | 13.5 |
| 2 | 台积电 | 领军企业 | 中国台湾 | 13.5 |
| 低功耗器件技术 | 1 | IBM | 领军企业 | 美国 | 10.7 |
| 2 | 台湾阳明交通大学 | 研究型大学 | 中国台湾 | 8.9 |
| 3 | 台湾半导体研究中心 | 科研机构 | 中国台湾 | 8.9 |
| CFET器件技术 | 1 | IMEC | 科研机构 | 比利时 | 38.5 |
| 2 | CEA-Leti | 科研机构 | 法国 | 30.8 |
| 量子器件技术 | 1 | CEA-Leti | 科研机构 | 法国 | 17.5 |
| 2 | IMEC | 科研机构 | 比利时 | 11.1 |
| 3 | 代尔夫特理工大学 | 研究型大学 | 荷兰 | 11.1 |
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