Article(id=1241718780519306157, tenantId=1146029695717560320, journalId=1146032081894723586, issueId=1241718213453607496, articleNumber=null, orderNo=null, doi=10.3981/j.issn.2097-0781.2022.03.003, pmid=null, cstr=null, oa=null, hot=null, price=null, onlineType=0, articleFormat=0, articleType=null, articleTypeStr=research-article, receivedDate=1659974400000, receivedDateStr=2022-08-09, revisedDate=1661702400000, revisedDateStr=2022-08-29, acceptedDate=null, acceptedDateStr=null, onlineDate=1667491200000, onlineDateStr=2022-11-04, pubDate=1663603200000, pubDateStr=2022-09-20, doiRegisterDate=null, doiRegisterDateStr=null, onlineIssueDate=1667491200000, onlineIssueDateStr=2022-11-04, onlineJustAcceptDate=null, onlineJustAcceptDateStr=null, onlineFirstDate=null, onlineFirstDateStr=null, sourceXml=null, magXml=null, createTime=1773978427292, creator=sys-migrate, updateTime=1773978427292, updator=sys-migrate, issue=Issue{id=1241718213453607496, tenantId=1146029695717560320, journalId=1146032081894723586, year='2022', volume='1', issue='3', pageStart='10', pageEnd='148', issueExtLink='null', onlineDate='null', pubDate='null', beforeIssueId=null, nextIssueId=null, price=null, status=1, issueComplete=1, articleOrder=1, issueType=-1, specialIssue=1, createTime=1773978292094, creator=sys-migrate, updateTime=1776075247554, updator=13041195026, preIssue=null, nextIssue=null, ext={EN=IssueExt(id=1250513482186179119, tenantId=1146029695717560320, journalId=1146032081894723586, issueId=1241718213453607496, language=EN, specialIssueTitle=Science and Technology Foresight, coverIllustrator=null, specialIssueEditor=null, specialIssueAbout=null), CN=IssueExt(id=1250513482186179120, tenantId=1146029695717560320, journalId=1146032081894723586, issueId=1241718213453607496, language=CN, specialIssueTitle=集成电路科学与工程专刊, coverIllustrator=null, specialIssueEditor=null, specialIssueAbout=null)}, issueFiles=null}, startPage=42, endPage=51, ext={EN=ArticleExt(id=1241718789809697237, articleId=1241718780519306157, tenantId=1146029695717560320, journalId=1146032081894723586, language=EN, title=Prospects of Advanced Integrated Circuit Technologies in Post-Moore Era, columnId=1149656489310208610, journalTitle=Science and Technology Foresight, columnName=Review and Commentary, runingTitle=null, highlight=null, articleAbstract=

As the cornerstone of the modern information society, integrated circuit (IC) has promoted the development of various industries and profoundly affected people’s living habits, work styles, and thinking patterns. So far, Moore’s law-oriented IC has been developed for over 60 years. As process nodes continuously evolve, manufacturing and design costs of IC rise significantly, and the yield and production efficiency of IC begin to decrease. In recent years, new processes, materials, and technologies have been introduced in the IC field, and novel application methods, application scenarios, and development paths have emerged, which boost the development of IC. IC has entered the post-Moore era quietly. Therefore, it is of great research significance and application value to sort out the main technological paths and characteristics of advanced IC in the post-Moore era. This paper firstly analyzes the technological challenges of Moore’s law-oriented IC during development as well as the basic characteristics of IC in the post-Moore era. Then, it reviews recent research progress and achievements of IC both in China and abroad, discusses the advantages and disadvantages of related technological paths in China, and puts forward strategies and measures for promoting the development of IC. Finally, the paper draws conclusions and predicts the future trend of advanced IC technologies in the post-Moore era.

, correspAuthors=Junchen DONG, Xing ZHANG, authorNote=null, correspAuthorsNote=
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集成电路被誉为现代信息社会的基石,推动了各个产业的发展和进步,深刻影响着人们的生活习惯、工作方式、思维模式。集成电路以摩尔定律为导向发展了60多年,随着工艺节点的不断演进,电路制造和设计成本大幅攀升,产品良率和生产效率开始出现下降的苗头。近年来,一系列新工艺、新材料、新技术被引入集成电路领域,形成了新的应用方式、使用场景、发展路径,为集成电路发展注入强心剂,集成电路后摩尔时代悄然而至。因此,对后摩尔时代先进集成电路主要技术路径及其特点进行梳理具有重要的研究意义和应用价值。文章总结了集成电路沿摩尔定律发展面临的技术困境以及后摩尔时代集成电路的基本特征,归纳了集成电路领域的国内外新近学术进展和研究成果,分析了中国在相关技术路径上的潜力与不足,并提出相应发展对策和可行措施。最后,总结和展望了后摩尔时代先进集成电路技术的未来发展趋势。

, correspAuthors=董俊辰, 张兴, authorNote=null, correspAuthorsNote=
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董俊辰,副教授。主要研究方向为新型电子器件。电子信箱:

张兴,教授,博士研究生导师。国家杰出青年科学基金获得者。主要致力于小尺寸MOS器件物理与结构、CMOS集成电路工艺与设计技术、新型纳米半导体器件和集成电路等方面的研究。获国家技术发明奖二等奖、北京市科学技术奖一等奖、教育部科学技术进步奖一等奖等。发表论文200余篇。申请发明专利100余项,获授权发明专利40余项。电子信箱:

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董俊辰,副教授。主要研究方向为新型电子器件。电子信箱:

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董俊辰,副教授。主要研究方向为新型电子器件。电子信箱:

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张兴,教授,博士研究生导师。国家杰出青年科学基金获得者。主要致力于小尺寸MOS器件物理与结构、CMOS集成电路工艺与设计技术、新型纳米半导体器件和集成电路等方面的研究。获国家技术发明奖二等奖、北京市科学技术奖一等奖、教育部科学技术进步奖一等奖等。发表论文200余篇。申请发明专利100余项,获授权发明专利40余项。电子信箱:

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张兴,教授,博士研究生导师。国家杰出青年科学基金获得者。主要致力于小尺寸MOS器件物理与结构、CMOS集成电路工艺与设计技术、新型纳米半导体器件和集成电路等方面的研究。获国家技术发明奖二等奖、北京市科学技术奖一等奖、教育部科学技术进步奖一等奖等。发表论文200余篇。申请发明专利100余项,获授权发明专利40余项。电子信箱:

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Prospects of Advanced Integrated Circuit Technologies in Post-Moore Era
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Junchen DONG 1, , Xing ZHANG 2,
Science and Technology Foresight | Review and Commentary 2022,1(3): 42-51
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Science and Technology Foresight | Review and Commentary 2022, 1(3): 42-51
Prospects of Advanced Integrated Circuit Technologies in Post-Moore Era
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Junchen DONG1, , Xing ZHANG2,
Authors
  • 1. School of Information and Communication Engineering, Beijing Information Science & Technology University, Beijing 100101, China
  • 2. School of Integrated Circuits, Peking University, Beijing 100871, China

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Prospects of Advanced Integrated Circuit Technologies in Post-Moore Era
Junchen DONG1, , Xing ZHANG2,
Affiliations
  • 1. School of Information and Communication Engineering, Beijing Information Science & Technology University, Beijing 100101, China
  • 2. School of Integrated Circuits, Peking University, Beijing 100871, China
Published: 2022-09-20 doi: 10.3981/j.issn.2097-0781.2022.03.003
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As the cornerstone of the modern information society, integrated circuit (IC) has promoted the development of various industries and profoundly affected people’s living habits, work styles, and thinking patterns. So far, Moore’s law-oriented IC has been developed for over 60 years. As process nodes continuously evolve, manufacturing and design costs of IC rise significantly, and the yield and production efficiency of IC begin to decrease. In recent years, new processes, materials, and technologies have been introduced in the IC field, and novel application methods, application scenarios, and development paths have emerged, which boost the development of IC. IC has entered the post-Moore era quietly. Therefore, it is of great research significance and application value to sort out the main technological paths and characteristics of advanced IC in the post-Moore era. This paper firstly analyzes the technological challenges of Moore’s law-oriented IC during development as well as the basic characteristics of IC in the post-Moore era. Then, it reviews recent research progress and achievements of IC both in China and abroad, discusses the advantages and disadvantages of related technological paths in China, and puts forward strategies and measures for promoting the development of IC. Finally, the paper draws conclusions and predicts the future trend of advanced IC technologies in the post-Moore era.

post-Moore era  /  integrated circuit  /  Moore’s law  /  chip

As the cornerstone of the modern information society, integrated circuit (IC) has promoted the development of various industries and profoundly affected people’s living habits, work styles, and thinking patterns. So far, Moore’s law-oriented IC has been developed for over 60 years. As process nodes continuously evolve, manufacturing and design costs of IC rise significantly, and the yield and production efficiency of IC begin to decrease. In recent years, new processes, materials, and technologies have been introduced in the IC field, and novel application methods, application scenarios, and development paths have emerged, which boost the development of IC. IC has entered the post-Moore era quietly. Therefore, it is of great research significance and application value to sort out the main technological paths and characteristics of advanced IC in the post-Moore era. This paper firstly analyzes the technological challenges of Moore’s law-oriented IC during development as well as the basic characteristics of IC in the post-Moore era. Then, it reviews recent research progress and achievements of IC both in China and abroad, discusses the advantages and disadvantages of related technological paths in China, and puts forward strategies and measures for promoting the development of IC. Finally, the paper draws conclusions and predicts the future trend of advanced IC technologies in the post-Moore era.

post-Moore era  /  integrated circuit  /  Moore’s law  /  chip
董俊辰, 张兴. 后摩尔时代先进集成电路技术展望[J]. 前瞻科技, 2022 , 1 (3) : 10 -148 . DOI: 10.3981/j.issn.2097-0781.2022.03.003
Junchen DONG, Xing ZHANG. Prospects of Advanced Integrated Circuit Technologies in Post-Moore Era[J]. Science and Technology Foresight, 2022 , 1 (3) : 10 -148 . DOI: 10.3981/j.issn.2097-0781.2022.03.003
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doi: 10.3981/j.issn.2097-0781.2022.03.003
  • Received:2022-08-09
  • Published:2022-09-20
  • Release:2022-11-04
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  • 收稿日期:2022-08-09
  • 修回日期:2022-08-29
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国家自然科学基金(62004003)
Authors
    1. School of Information and Communication Engineering, Beijing Information Science & Technology University, Beijing 100101, China
    2. School of Integrated Circuits, Peking University, Beijing 100871, China

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董俊辰, 张兴. 后摩尔时代先进集成电路技术展望[J]. 前瞻科技, 2022 , 1 (3) : 10 -148 . DOI: 10.3981/j.issn.2097-0781.2022.03.003
Junchen DONG, Xing ZHANG. Prospects of Advanced Integrated Circuit Technologies in Post-Moore Era[J]. Science and Technology Foresight, 2022 , 1 (3) : 10 -148 . DOI: 10.3981/j.issn.2097-0781.2022.03.003
表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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