Science & Technology Review
|
2024, 42(24): 30-45
• Exclusive:Thermal management technology and applications •
Research progress on cooling of electronic equipment based on liquid metal convection
Full
CHANG Xiangting, DONG Wei, HAN Junjie, DONG Jinxi, LIU Zhihu, ZHAO Hang
Affiliations
Published: 2024-12-28
doi: 10.3981/j.issn.1000-7857.2024.01.00124
Outline
Benefiting from the excellent thermal conductivity and flow properties of liquid metal, liquid metal convection cooling offers a new solution to the high heat flux thermal management of electronic devices and equipment. In this paper, the heat transfer and flow characteristics of liquid metal convection were introduced. Compared to traditional fluids, the high thermal conductivity of liquid metals resulted in lower overall thermal resistance, and the heat transfer performance was better. The relevant research progress of driving technology, hybrid cooling technology and heat transfer enhancement technology based on liquid metal convection were summarized. The application status of liquid metal convection in the field of electronic equipment cooling was briefly described. Finally, the challenges and development prospects of liquid metal convection cooling were discussed.
liquid metal
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convective heat transfer
/
electronic equipment
/
high heat flux
常向廷, 董伟, 韩俊杰, 董进喜, 刘治虎, 赵航.
基于液态金属对流的电子设备冷却研究进展.
科技导报,
2024
, 42
(24)
: 30
-45
.
DOI: 10.3981/j.issn.1000-7857.2024.01.00124
CHANG Xiangting, DONG Wei, HAN Junjie, DONG Jinxi, LIU Zhihu, ZHAO Hang.
Research progress on cooling of electronic equipment based on liquid metal convection[J].
Science & Technology Review,
2024
, 42
(24)
: 30
-45
.
DOI: 10.3981/j.issn.1000-7857.2024.01.00124
Year 2024 volume 42 Issue 24
1109
370
Cite this Article
BibTeX
Article Info
doi: 10.3981/j.issn.1000-7857.2024.01.00124
- Receive Date:2024-01-18
- Online Date:2025-01-15
- Published:2024-12-28