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Research progress on cooling of electronic equipment based on liquid metal convection
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Science & Technology Review | 2024, 42(24) : 30 - 45
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Science & Technology Review | 2024, 42(24): 30-45
Exclusive:Thermal management technology and applications
Research progress on cooling of electronic equipment based on liquid metal convection
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CHANG Xiangting, DONG Wei, HAN Junjie, DONG Jinxi, LIU Zhihu, ZHAO Hang
Affiliations
    Aeronautics Computing Technique Research Institute, Aviation Industry Corporation of China, Xi'an 710065, China
Published: 2024-12-28 doi: 10.3981/j.issn.1000-7857.2024.01.00124
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Benefiting from the excellent thermal conductivity and flow properties of liquid metal, liquid metal convection cooling offers a new solution to the high heat flux thermal management of electronic devices and equipment. In this paper, the heat transfer and flow characteristics of liquid metal convection were introduced. Compared to traditional fluids, the high thermal conductivity of liquid metals resulted in lower overall thermal resistance, and the heat transfer performance was better. The relevant research progress of driving technology, hybrid cooling technology and heat transfer enhancement technology based on liquid metal convection were summarized. The application status of liquid metal convection in the field of electronic equipment cooling was briefly described. Finally, the challenges and development prospects of liquid metal convection cooling were discussed.
liquid metal  /  convective heat transfer  /  electronic equipment  /  high heat flux
CHANG Xiangting, DONG Wei, HAN Junjie, DONG Jinxi, LIU Zhihu, ZHAO Hang. Research progress on cooling of electronic equipment based on liquid metal convection[J]. Science & Technology Review, 2024 , 42 (24) : 30 -45 . DOI: 10.3981/j.issn.1000-7857.2024.01.00124
Year 2024 volume 42 Issue 24
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doi: 10.3981/j.issn.1000-7857.2024.01.00124
  • Receive Date:2024-01-18
  • Online Date:2025-01-15
  • Published:2024-12-28
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  • Received:2024-01-18
  • Revised:2024-09-17
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https://castjournals.cast.org.cn/joweb/kjdb/EN/10.3981/j.issn.1000-7857.2024.01.00124
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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