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Two−dimensional materials lead the post−Moore era
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Jiayu MA1, 2, Zhongheng SUN1, Yuhan ZHAO1, Hu ZHAO3, Hao GUO2, *, He TIAN1, *
Science & Technology Review | 2025, 43(17) : 16 - 21
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Science & Technology Review | 2025, 43(17): 16-21
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Two−dimensional materials lead the post−Moore era
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Jiayu MA1, 2, Zhongheng SUN1, Yuhan ZHAO1, Hu ZHAO3, Hao GUO2, *, He TIAN1, *
Affiliations
  • 1. School of Integrated Circuits, Tsinghua University, Beijing 100084, China
  • 2. School of Semiconductors and Physics, North University of China, Taiyuan 030051, China
  • 3. Yangtze Delta Region Institute of Tsinghua University, Jiaxing 314006, China
Published: 2025-09-13 doi: 10.3981/j.issn.1000-7857.2025.05.00127
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Due to their excellent physical and chemical properties, two−dimensional materials have become potential stocks in the fields of integrated circuits, wearable technology, medical monitoring, etc. in the "post−Moore era", and have become a research hotspot in the current academic and industrial circles. Firstly, the bottlenecks and challenges faced in the post−Moore era are introduced. Secondly, the development history, preparation methods, ultra−thinness, adjustable band gap and ultra−high mobility of two−dimensional materials are introduced, and the application prospects of two−dimensional materials in chips, flexible sensors, energy storage, optoelectronic devices and other fields are analyzed. Then, the problems faced by two−dimensional materials in practical applications, such as large−scale preparation, high process complexity, and large differences between actual tests and expected theoretical values, are discussed. It is proposed to make up for these shortcomings through new atomic catalysts, roll−to−roll transfer technology, hydrogen passivation and other means to explore the potential of two−dimensional materials. Finally, the direction and path of the development of two−dimensional materials are summarized, emphasizing the importance of silicon−based transformation of two−dimensional materials, multi−dimensional innovation and industrialization promotion.

2D materials  /  ultra−thin structure  /  high mobility  /  Moore's Law  /  integrated circuits  /  silicon−based technology
Jiayu MA, Zhongheng SUN, Yuhan ZHAO, Hu ZHAO, Hao GUO, He TIAN. Two−dimensional materials lead the post−Moore era[J]. Science & Technology Review, 2025 , 43 (17) : 16 -21 . DOI: 10.3981/j.issn.1000-7857.2025.05.00127
Year 2025 volume 43 Issue 17
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Article Info
doi: 10.3981/j.issn.1000-7857.2025.05.00127
  • Receive Date:2025-05-22
  • Online Date:2025-12-18
  • Published:2025-09-13
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  • Received:2025-05-22
  • Revised:2025-07-01
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Affiliations
    1. School of Integrated Circuits, Tsinghua University, Beijing 100084, China
    2. School of Semiconductors and Physics, North University of China, Taiyuan 030051, China
    3. Yangtze Delta Region Institute of Tsinghua University, Jiaxing 314006, China
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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