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Hotspots and trends in collaborative research of numerical simulation and multiphysics in 2024: A review
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Bo PU1, Wenchao CHEN2, Zhaofu ZHANG3, Zenghui CHEN4, Yi ZHAO5, Qinfen HAO6, 7, *, Ninghui SUN7
Science & Technology Review | 2025, 43(1) : 118 - 131
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Science & Technology Review | 2025, 43(1): 118-131
• Exclusive: Review of Science and Technology Hotspots in 2024 •
Hotspots and trends in collaborative research of numerical simulation and multiphysics in 2024: A review
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Bo PU1, Wenchao CHEN2, Zhaofu ZHANG3, Zenghui CHEN4, Yi ZHAO5, Qinfen HAO6, 7, *, Ninghui SUN7
Affiliations
  • 1. Ningbo DeTooLIC Technology, Co., Ltd., Ningbo 315800, China
  • 2. College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China
  • 3. The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China
  • 4. PhySim Electronic Technology Co., Ltd., Shanghai 201306, China
  • 5. Zhuhai Silicon Chip Technology Ltd., Zhuhai 519060, China
  • 6. Wuxi Institute of Interconnect Technology, Wuxi 214104, China
  • 7. Institute of Computing Technology, Chinese Academy of Sciences, Beijing 100086, China
Published: 2025-01-13 doi: 10.3981/j.issn.1000-7857.2024.12.01753
Outline
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multiphysics coupling  /  simulation and numerical analysis techniques  /  reliability  /  semiconductor devices  /  integrated chips and chiplets  /  electronic design automation
蒲菠, 陈文超, 张召富, 陈增辉, 赵毅, 郝沁汾, 孙凝晖. 2024年数值仿真计算与多物理场协同研究热点回眸. 科技导报, 2025 , 43 (1) : 118 -131 . DOI: 10.3981/j.issn.1000-7857.2024.12.01753
Bo PU, Wenchao CHEN, Zhaofu ZHANG, Zenghui CHEN, Yi ZHAO, Qinfen HAO, Ninghui SUN. Hotspots and trends in collaborative research of numerical simulation and multiphysics in 2024: A review[J]. Science & Technology Review, 2025 , 43 (1) : 118 -131 . DOI: 10.3981/j.issn.1000-7857.2024.12.01753
Appendix
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Year 2025 volume 43 Issue 1
5539
2815
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Article Info
doi: 10.3981/j.issn.1000-7857.2024.12.01753
  • Receive Date：2024-12-16
  • Online Date：2025-07-31
  • Published：2025-01-13
Article Data
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History
  • Received：2024-12-16
  • Revised：2025-01-04
Affiliations
    1. Ningbo DeTooLIC Technology, Co., Ltd., Ningbo 315800, China
    2. College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China
    3. The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China
    4. PhySim Electronic Technology Co., Ltd., Shanghai 201306, China
    5. Zhuhai Silicon Chip Technology Ltd., Zhuhai 519060, China
    6. Wuxi Institute of Interconnect Technology, Wuxi 214104, China
    7. Institute of Computing Technology, Chinese Academy of Sciences, Beijing 100086, China
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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