As design costs at advanced process nodes grow exponentially, the chiplet architecture is regarded as a key path to break through the economic bottleneck of monolithic integration. However, the current chiplet industry faces a threefold dilemma of "suspended standards, high barriers, and a sparse ecosystem": although interconnect standards such as the Universal Chiplet Interconnect Express (UCIe) consortium are evolving rapidly, a vast engineering gap remains between the standard specification and a manufacturable physical implementation; leading vendors generally rely on in−house proprietary solutions, so the standards lack tape−out validation from real products and are difficult to refine; and the high development cost deters small and medium−sized enterprises, leaving ecosystem participants extremely scarce. This paper proposes the concept of a "chiplet library", a hybrid rapid−verification system based on an FPGA prototyping platform, a chiplet−interconnect physical−layer (PHY) verification card, and EDA simulation compensation. The field−programmable gate array (FPGA) platform carries the programmable verification of chiplet functional logic and the digital layer of the interconnect protocol; the physical−layer verification card uses a real advanced−packaging process to provide direct measurement of in−package interconnect channels; and electronic design automation (EDA) simulation tools compensate for the complete on−chip (OC) physical−field environment missing on the verification card—including power distribution network (PDN) noise, thermal coupling, and cross−die interference—while supporting extrapolation to packaging−process variants. Together the three form a complete verification chain. The known limitations of this approach, in terms of operating−frequency differences, interface intellectual property (IP) partitioning, and the lack of a complete system−on−chip (SoC) physical environment, are analyzed and corresponding strategies are proposed. The industrial significance of the chiplet library is then discussed with respect to driving the iterative practice of standards, revitalizing existing chip resources, and accelerating the maturation of incremental chiplet−architecture development.