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To address the growing demand for thermal dissipation substrates in high−power electronic devices, this study focuses on overcoming the mechanical limitations of aluminum nitride (AlN) ceramics and the reduction in thermal conductivity associated with conventional toughening methods. A phase−compatible toughening strategy using one−dimensional AlN whiskers is proposed. AlN whiskers were synthesized via direct nitridation and incorporated into AlN ceramics through dry pressing and atmospheric pressure sintering at elevated temperature. The results indicate that the AlN whiskers form strong interfacial bonds with the matrix, effectively reducing thermal boundary resistance. Its high aspect ratio creates continuous, highly efficient heat conduction pathways, which collectively enhance the thermal and mechanical properties of the AlN ceramic. The optimized composites achieved a thermal conductivity of 189.49 W·m−1·K−1, a flexural strength of 255.13 MPa, and a fracture toughness of 3.25 MPa·m1/2, corresponding to enhancements of 7.2%, 150.8%, and 24.5%, respectively, compared to unreinforced AlN. Microstructural analysis combined with finite element simulations confirms that the AlN whiskers effectively redistribute mechanical stress and suppress crack propagation. This work provides a viable approach for developing high−performance ceramic substrates with integrated thermal management and structural reliability for advanced electronic packaging applications.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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