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Overview of the development status of chiplet technology
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Science & Technology Review | 2023, 41(19) : 113 - 131
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Science & Technology Review | 2023, 41(19): 113-131
Innovation leads selfreliance and selfimprovement—creating a source of high-quality technological
Overview of the development status of chiplet technology
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XIANG Shaolin , GUO Mao , PU Bo , FANG Liulu , LIU Shujuan , WANG Shaoyong , KONG Xianwei , ZHENG Tuo , LIU Jun ,ZHAO Ming9, HAO Qinfen9, 10*, SUN Ninghui10
Affiliations
    1. Hefei Geneturino Microelectronics Co., Ltd., Hefei 230041, China
    2. Shanghai Professional Technical Service Platform of Microanalysis for Microelectronics Materials and Components, Shanghai
    201210, China
    3. DeTooLIC Technology, Co., Ltd., Ningbo 315800, China
    4. Akrostar Technology Co., Ltd., Zhuhai 519031, China
    5. Hubei Yangtze Memory Laboratories, Wuhan 430205, China
    6. xFusion Digital Technologies Co., Ltd., Dongguan 523106, China
    7. China Electronics Standardization Institute, Beijing 100007, China
    8. Xpeedic Co., Ltd., Shanghai 201210, China
    9. Wuxi Institute of Interconnect Technology, Wuxi 214104, China
    10. Institute of Computing Technology, Chinese Academy of Sciences, Beijing 100086, China
Published: 2023-10-13 doi: 10.3981/j.issn.1000-7857.2023.19.013
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Chiplet technology is a new generation of integrated circuit technology that has emerged in recent years. It has been widely recognized by the industry due to its excellent characteristics such as improving yield, breaking the limit of reticle size, flexibility in chip architecture, and standardization of IP supply chain. To further promote the development of chiplet technology in China, this article summarizes the application scenarios of chiplet technology, analyzes various core component technologies, elaborates on various technical challenges that may arise in the development of chiplet technology, reviews the development of China’s chiplet standards, and finally, puts forward some suggestions for the development of chiplet technology in China.
chiplet technology  /  chiplet interconnect interfaces  /  advanced packaging  /  multi physical field electronic assisted design  /  signal and power integrity
XIANG Shaolin,GUO Mao,PU Bo,FANG Liulu,LIU Shujuan,WANG Shaoyong,KONG Xianwei,ZHENG Tuo,LIU Jun,ZHAO Ming,HAO Qinfen,SUN Ninghui. Overview of the development status of chiplet technology[J]. Science & Technology Review, 2023 , 41 (19) : 113 -131 . DOI: 10.3981/j.issn.1000-7857.2023.19.013
Year 2023 volume 41 Issue 19
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doi: 10.3981/j.issn.1000-7857.2023.19.013
  • Receive Date:2023-05-22
  • Online Date:2023-10-27
  • Published:2023-10-13
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  • Received:2023-05-22
  • Revised:2023-07-22
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
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Genus
种数
Number of
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占总种数比例
Percentage of total
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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