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Huang Kun's scientific contribution and academic tradition
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Science & Technology Review | 2019, 37(17) : 43 - 49
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Science & Technology Review | 2019, 37(17): 43-49
• Exclusive: Marking 100 years since Huang Kun's birth •
Huang Kun's scientific contribution and academic tradition
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WANG Zhirong1, DING Zhaojun2
Affiliations
    1. Department of Physics, Anhui Normal University, Wuhu 24002, China;
    2. Department for the History of Science and Scientific Archaeology, University of Science and Technology, Hefei 230026, China
Published: 2019-09-13 doi: 10.3981/j.issn.1000-7857.2019.17.010
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On the basis of studying historical documents, this paper introduces Huang Kun's academic growth process, systematically analyses his outstanding achievements in solid state physics, and discusses his contribution to develop semiconductor industry for his motherland. In China, Huang Kun's contribution includes establishing the first base for training professional personnel, founding a important base for research semiconductor physics, and training academic tradition.
Huang Kun  /  solid state physics  /  semiconductor physics  /  academic tradition
汪志荣, 丁兆君. 黄昆先生的科学贡献及其开创的学术传统. 科技导报, 2019 , 37 (17) : 43 -49 . DOI: 10.3981/j.issn.1000-7857.2019.17.010
WANG Zhirong, DING Zhaojun. Huang Kun's scientific contribution and academic tradition[J]. Science & Technology Review, 2019 , 37 (17) : 43 -49 . DOI: 10.3981/j.issn.1000-7857.2019.17.010
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doi: 10.3981/j.issn.1000-7857.2019.17.010
  • Receive Date：2019-08-01
  • Online Date：2019-09-25
  • Published：2019-09-13
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  • Received：2019-08-01
  • Revised：2019-08-21
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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