Science & Technology Review
|
2018, 36(7): 64-73
• Reviews •
Current status and prospects of electrochemical migration research
Full
YI Pan1, DONG Chaofang1, XIAO Kui1, WEI Dan2
Affiliations
1. Key Laboratory for Corrosion and Protection of the Ministry of Education;Corrosion and Protection Center, University of Science and Technology Beijing, Beijing 100083, China;
2. Service Center for Societies, China Association for Science and Technology, Beijing 100081, China
Published: 2018-04-13
doi: 10.3981/j.issn.1000-7857.2018.07.010
Outline
Currently, electronic components are becoming more integrated and more miniaturized, which substantially increases the sensitivity of electrochemical migration (ECM). In this paper, the current status and prospects of electrochemical migration research are reviewed in terms of research methods, failure mechanism and protection methods. In addition, a newly method that improves the sensitivity of ECM is also provided.
electronic components
/
electrochemical migration
/
protection method
易盼, 董超芳, 肖葵, 魏丹.
电化学迁移研究进展.
科技导报,
2018
, 36
(7)
: 64
-73
.
DOI: 10.3981/j.issn.1000-7857.2018.07.010
YI Pan, DONG Chaofang, XIAO Kui, WEI Dan.
Current status and prospects of electrochemical migration research[J].
Science & Technology Review,
2018
, 36
(7)
: 64
-73
.
DOI: 10.3981/j.issn.1000-7857.2018.07.010
Year 2018 volume 36 Issue 7
PDF
639
143
Cite this Article
BibTeX
Article Info
doi: 10.3981/j.issn.1000-7857.2018.07.010
- Receive Date:2017-01-16
- Online Date:2018-04-27
- Published:2018-04-13