Polyimide (PI) has attracted wide attention in the field of new high-temperature energy storage dielectric materials because of its excellent properties. Compared with inorganic/PI composite dielectric materials, all-organic PI composite dielectric materials can maintain excellent mechanical properties while obtaining high dielectric permittivity and high energy storage density. This paper firstly discussed the key parameters affecting the energy storage characteristics of polymer dielectric materials, including dielectric permittivity, dielectric loss, breakdown field strength, energy storage density, charge/discharge efficiency, and heat resistance. And then introduced the key factors and development trends affecting the energy storage characteristics of all-organic PI composite dielectric materials from physical blending and chemical blending, respectively. Finally, the problem of how to effectively improve the high-temperature energy storage characteristics of all-organic PI composite dielectric materials was summarized and the future development direction was proposed.

In the life evaluation of polyimide (PI) film modified by nano TiO₂, a small sample insulation life evaluation method based on gray neural network was proposed to solve the problems such as lack of failure data, life distribution cannot be determined uniquely, high cost, and long test time. Nano TiO₂ modified PI film was prepared by in-situ polymerization method, and the accelerated electrical ageing test was conducted on the films to obtain the failure data. The grey neural network was constructed and trained to obtain the extended data with the similar characteristics and changing rules with the original data. The least square method was used for parameter estimation, and the life evaluation results of different failure data samples, distribution models, empirical cumulative failure functions were analyzed and compared. The different life evaluation schemes before and after extending were analyzed by calculation example. The results show that the combination of Weibull distribution and mathematical expectation formula is more suitable for life evaluation of original sample size.The evaluation of insulation life using expanded failure data has a better effect, and the combination of inverse power function model, lognormal distribution, and median empirical formula is the most suitable for the life evaluation of the extended samples.

The development in the field of electronics and microelectronics has greatly promoted the research on thermally conductive polymer film materials. However, there is a lack of systematic study on both the analyzing technology of thermal conductivity and the testing methods suitable for polymer films. The light/laser flash analysis (LFA) is the most representative method in transient analysis technique. In this paper, the basic principle, testing conditions and application scope of LFA method were systematically introduced. Thermally conductive polyimide films were taken as the representative examples to analyze the key factors on the testing results in detail, including the film thickness, surface quality, pretreatment conditions, instrument parameters, and data analyzing and processing. In addition, the application of LFA method for testing thermal conductivity along different directions of polymer film materials was further discussed. The results show that the thickness accuracy, surface quality, and transparency of the samples will affect the test results, and the pretreatment methods such as gold sputtering or graphite spraying can effectively improve the test accuracy. In addition, the parameter setting and data processing of the testing instrument will affect the shape of temperature-time curve and the fitting results. Thus, it is necessary to reasonably select the appropriate testing conditions according to the characteristics of polymer film samples.

In order to study the effect of silane coupling agent modification on the thermomechanical and dielectric properties of SiO₂/PI composite and its internal mechanism, we established the composite model of pure PI, SiO₂/PI and SiO₂/PI with 6% and 12% of the grafting density of silane coupling agent on the surface of SiO₂. The solubility parameters, interaction energy, glass transition temperature, Young's modulus, shear modulus, mean square displacement, free volume fraction, relative permittivity, and dielectric strength of the four models were calculated. The results show that the silane coupling agent modification significantly improves the thermomechanical and dielectric properties of the composite material, and the graft density has an obvious effect on the modification effect. The SiO₂/PI composite system with 6% of grafting density of silane coupling agent has the best thermomechanical properties, while maintains a lower relative permittivity and a higher dielectric strength. In addition, the two systems grafted by silane coupling agent have smaller free volume fraction and mean square displacement, as well as larger solubility parameters and interaction energy. It is indicated that limiting the movement of molecular chains and improving the compatibility between SiO₂ and PI matrix are the keys to improving the thermomechanical and dielectric properties of composite materials.

Modified boron nitride (BN)/polyimide (PI) composites were prepared by in-situ polymerization using surface modified BN with terminal group of amino, carboxyl, and hydroxyl and unmodified BN nanosheets as fillers. The effects of BN modified by amino (BN-NH₂), carboxyl (BN-COOH), and hydroxyl (BN-OH) and BN on the thermal conductivity of the composites at different temperatures were investigated. The results show that thermal diffusivity of the composite increases with the increase of the mass fraction of BN-NH₂. With the increasing of BN-COOH and BN-OH, the thermal diffusivity of the composites increases at first and then decreases, reaches to the peak when the mass fraction of fillers is 2%. At 200 ℃, the thermal diffusivity of BN-NH₂/PI reaches to the maximum when the mass fraction of fillers is 5%, while that of BN-COOH/PI and BN-OH/PI reaches to the maximum at when the mass fraction of fillers is 2%, and BN-COOH/PI shows the highest thermal diffusivity. Therefore, surface modification by amino is beneficial for BN/PI composites to obtain a higher thermal conductivity at high fillers content, while carboxyl modification is the best choice to obtain the highest thermal conductivity.

With the miniaturization and light-weighting of electronic equipment, graphite films with high thermal conductivity attract extensive attention. In this paper, a series of nanocomposite films were prepared by copolymerizing p-phenylenediamine (p-PDA) with 4,4′-oxybisbenzenamine (ODA) and 1,2,4,5-benzenetetracarboxylic anhydride (PMDA), and various two-dimensional carbon nanomaterials, including graphene oxide (GO), reduced graphene oxide (rGO), and graphene (GP), were added via mechanical mixing. And then corresponding graphite films were obtained after high-temperature sintering of polyimide films at 2 850℃, the morphology and crystal type of graphite films were analyzed. The results show that graphite films with two-dimensional carbon nanomaterials are flat, they exhibit more flexible, higher degree of graphitization, and larger crystal size, and the lamellar spacing is closer to the ideal graphite. In particular, the horizontal thermal conductivity and vertical thermal conductivity of graphite film containing 2% of GO nanosheets is 1 207 W/(m·K) and 8.38 W/(m·K), respectively. It is concluded that GO nanosheets can induce graphitization of polyimide films under high temperature, and the graphite sheet sintered shows excellent thermal conductivity.

A semi-alicyclic polyimide resin (TFCPI) and the derived colorless and transparent polyimide film (TFCPI-0) were prepared by one-step high-temperature polycondensation using 1S,2R,4S,5R-hydrogenated pyromellitic dianhydride (H-PMDA) and a fluoro-containing aromatic diamine 2,2′-bis(trifluoromethyl)benzidine (TFMB). Then, a series of colorless and transparent polyimide/SiO₂ composite films with different loading amounts of nano-sized silica fillers were prepared via mechanical blending method by mixing TFCPI matrix with dispersion liquid of colloidal nano-silica/N,N-dimethylacetamide (DMAC). The results show that the loading amounts of nano-silica in the composite films can reach to 25%. The derived composite film TFCPI-25 shows the optical transmittance at the wavelength of 450 nm (T₄₅₀) and yellow index (b*) values of 87.5% and 1.56, respectively, which are slightly inferior to those of TFCPI-0 (T₄₅₀=88.5%, b^*=0.91). The 5% weight loss temperatures (T_5%) and glass transition temperature (T_g) of TFCPI-25 is at the same level with that of TFCPI-0. However, the storage modulus of TFCPI-25 at 50℃ (E′₅₀) and its linear coefficient of thermal expansion (CTE) in the range of 50-250℃ is 4.86 GPa and 30.9×10^-6 K^-1, respectively, which are obviously superior to those of TFCPI-0 (E′₅₀=3.02 GPa, CTE=39.6×10^-6 K^-1).

In order to further clarify the key properties of matrix resin in semiconducting shielding materials, three different types of semiconducting shielding materials at home and abroad were selected, and their microstructure characteristic, mechanical properties, electrical properties, and rheological properties were tested. The results show that the volume resistivity of each shielding material is low, and the temperature stability of resistivity is good. The acrylate content of the imported shielding material matrix resin is higher, polarity is greater, and the mechanical toughness is better. At the same time, the pseudoplasticity of the imported shielding material is stronger. In a certain shear rate range, the viscosity of the material can be reduced by increasing the shear rate appropriately, and the energy consumption can be reduced by increasing the fluidity, and then the production efficiency can be improved. Based on the results of the experimental analysis, the polarity or ester content of the material is proposed as a key parameter to reflect the matrix resin in the semiconductive shielding material.

The effect of thermal oxygen ageing on the properties of irradiated ethylene propylene diene rubber (EPDM) materials were analyzed, and its theoretical service life was evaluated by analyzing the change rule of compression permanent deformation rate with time. The results show that with the increase of ageing time and ageing temperature, the irradiated EPDM is aged more and more serious, the carbonyl content becomes higher and higher, and the compression set and compression stress relaxation become greater and greater. The SEM results show that the EPDM degrade seriously during ageing process. According to Arrhenius equation, the theoretical life of the irradiated EPDM is 7.58 years at 50℃.

Hindered phenolic antioxidant is a main antioxidants commonly used in cross-linked polyethylene (XLPE) insulation to improve its processability and long-term electrical performance. In order to discuss the effect of hindered phenolic antioxidants on the DC breakdown behavior of XLPE insulation deeply, two kinds of XLPE insulation samples containing different multi-hindered phenolic antioxidants were prepared, and their properties were measured. The results show that the addition of hindered phenolic antioxidants can obviously improve the electric strength and breakdown stability of XLPE insulation, this is because the addition of hindered phenolic antioxidant can introduce deep traps into XLPE insulation and increase the trap density. However, the energy levels and types of deep traps introduced by the two multi-hindered phenolic antioxidant are different, therefore the effects of them on the improving the electric strength of XLPE insulation are different. In addition, the addition of hindered phenol antioxidant can improve the crystallinity and crystallization uniformity of XLPE, but the effect is not obvious.