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Effect of silane coupling agent modification on thermomechanical and dielectric properties of SiO2/PI composite
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Yasha LI1, Peng SONG1, Hao XIE1, Dongdong CHEN1, Fanqiang MENG2, Wenji ZHOU3
Insulating Materials | 2023, 56(2) : 110 - 117
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Insulating Materials | 2023, 56(2): 110-117
• Material Research •
Effect of silane coupling agent modification on thermomechanical and dielectric properties of SiO2/PI composite
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Yasha LI1, Peng SONG1, Hao XIE1, Dongdong CHEN1, Fanqiang MENG2, Wenji ZHOU3
Affiliations
  • 1College of Electrical Engineering & New Energy, China Three Gorges University, Yichang 443002, China
  • 2State Grid Jining Power Supply Company, Jining 272000, China
  • 3State Grid Huanggang Power Supply Company, Huanggang 438000, China
Published: 2023-02-20 doi: 10.16790/j.cnki.1009-9239.im.2023.02.017
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In order to study the effect of silane coupling agent modification on the thermomechanical and dielectric properties of SiO2/PI composite and its internal mechanism, we established the composite model of pure PI, SiO2/PI and SiO2/PI with 6% and 12% of the grafting density of silane coupling agent on the surface of SiO2. The solubility parameters, interaction energy, glass transition temperature, Young's modulus, shear modulus, mean square displacement, free volume fraction, relative permittivity, and dielectric strength of the four models were calculated. The results show that the silane coupling agent modification significantly improves the thermomechanical and dielectric properties of the composite material, and the graft density has an obvious effect on the modification effect. The SiO2/PI composite system with 6% of grafting density of silane coupling agent has the best thermomechanical properties, while maintains a lower relative permittivity and a higher dielectric strength. In addition, the two systems grafted by silane coupling agent have smaller free volume fraction and mean square displacement, as well as larger solubility parameters and interaction energy. It is indicated that limiting the movement of molecular chains and improving the compatibility between SiO2 and PI matrix are the keys to improving the thermomechanical and dielectric properties of composite materials.

polyimide  /  silane coupling agent  /  thermomechanical  /  dielectric properties  /  compatibility
Yasha LI, Peng SONG, Hao XIE, Dongdong CHEN, Fanqiang MENG, Wenji ZHOU. Effect of silane coupling agent modification on thermomechanical and dielectric properties of SiO2/PI composite[J]. Insulating Materials, 2023 , 56 (2) : 110 -117 . DOI: 10.16790/j.cnki.1009-9239.im.2023.02.017
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2023.02.017
  • Receive Date：2022-01-09
  • Online Date：2025-11-21
  • Published：2023-02-20
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History
  • Received：2022-01-09
  • Revised：2022-02-26
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Affiliations
    1College of Electrical Engineering & New Energy, China Three Gorges University, Yichang 443002, China
    2State Grid Jining Power Supply Company, Jining 272000, China
    3State Grid Huanggang Power Supply Company, Huanggang 438000, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2023.02.017
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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