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Thermal Performance of Phase Change Material Energy Storage Structures for Electronic Devices
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Gong-li TAN1, Lin-wei GU1, Juan ZHAI2, Xue-kai ZHU1, Zhi-qiang DAI1
Science Technology and Engineering | 2025, 25(13) : 5415 - 5421
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Science Technology and Engineering | 2025, 25(13): 5415-5421
Papers·Mechanical and Instrumental Industry
Thermal Performance of Phase Change Material Energy Storage Structures for Electronic Devices
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Gong-li TAN1, Lin-wei GU1, Juan ZHAI2, Xue-kai ZHU1, Zhi-qiang DAI1
Affiliations
  • 1 The 723 Institute of CSSC, Yangzhou 225101, China
  • 2 College of Guangling, Yangzhou University, Yangzhou 225000, China
Published: 2025-05-08 doi: 10.12404/j.issn.1671-1815.2405066
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Aiming at the problem that it is difficult to directly use external heat sink to dissipate heat for high-power electronic devices with short-time operation in external insulation condition, the phase-change material with low melting point and high volume enthalpy value was adopted to optimize the design of energy storage structure and realize temperature control for electronic devices. Firstly, based on the constraints of electronic device volume, weight, external environment, thermal power, working time, etc., combined with the thermal performance of phase change materials, an integrated design of heat dissipation structure was carried out. Secondly, according to the characteristics of phase change material(PCM), an equivalent specific heat capacity thermal analysis method based on temperature feedback was proposed. Finally, the thermal conductivity of three PCM including paraffin, carbon composite and liquid metal, was analyzed by numerical simulation, and the heat dissipation performance of the three PCM in specificenergy-storage structures was evaluated by using heat source temperature rise and temperature equalization as indicators, and an optimal phase-change energy-storage structure of the electronic devices was determined. The results show that the PCM can significantly control the temperature rise in a certain period of time, which meets the temperature control requirements of electronic devices in small volume and external adiabatic environment. The volume enthalpy of PCM represents the energy storage capacity per unit volume of PCM. The higher the volume enthalpy, the smaller the volume of PCM required. Liquid metal can obtain better thermal properties because of its large enthalpy and high thermal conductivity.

volumetric enthalpy  /  paraffin  /  ene carbon composite material  /  liquid metal  /  equivalent specific heat capacity  /  numerical simulation
Gong-li TAN, Lin-wei GU, Juan ZHAI, Xue-kai ZHU, Zhi-qiang DAI. Thermal Performance of Phase Change Material Energy Storage Structures for Electronic Devices[J]. Science Technology and Engineering, 2025 , 25 (13) : 5415 -5421 . DOI: 10.12404/j.issn.1671-1815.2405066
Year 2025 volume 25 Issue 13
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doi: 10.12404/j.issn.1671-1815.2405066
  • Receive Date:2024-07-06
  • Online Date:2025-07-09
  • Published:2025-05-08
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  • Received:2024-07-06
  • Revised:2025-02-08
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    1 The 723 Institute of CSSC, Yangzhou 225101, China
    2 College of Guangling, Yangzhou University, Yangzhou 225000, China
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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