Polyimide (PI) film has become a key material for turn-to-turn insulation in electric drive motors due to its excellent high-temperature stability, superior mechanical properties, and outstanding electrical insulation performance. In this paper, the aggregation structure of PI were regulated by change the types of catalysts during the chemical imidization process. The effects of different catalysts on the aggregation structure of PI were discussed, and the effects of catalyst types on electro-thermal-mechanical properties and corona resistance of PI were studied systematically. The results show that the aromatic catalyst isoquinoline can promote the orderly arrangement of molecular chains through π-π interactions, and significantly enhancing the dielectric and corona resistance properties of PI. The PI film prepared using isoquinoline catalyst exhibits excellent dielectric performances. At a frequency of 1 kHz, its dielectric constant can reach 3.47, while the dielectric loss factor reduces to 0.001 1, and the electric strength at room-temperature reaches 561.39 kV/mm. Furthermore, its corona resistance performance is greatly improved. Under 20 kHz, the corona resistance lifetime reaches 5.8 min, which is 1.68 times that of the thermally imidized film.

Taking the 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) as dianhydride monomer, and the fluorine-containing diamine 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (6FAP) and 3,3′-dihydroxybiphenylamine (HAB) as the diamine monomers, a series of polyamic acid (PAA) precursors were synthesized by regulating the molar ratio of 6FAP and HAB. Then, polyamic acid esters (PAE) were synthesized through imidization and esterification reactions, and a series of polyimide (PI) films containing biphenyl units were prepared through cyclization reactions. The thermodynamic properties of the PI films were studied. The results show that when the molar fraction of HAB is 10%, the CTE of the PI film decreases from 46.2×10^-6 K^-1 to 38.1×10^-6 K^-1, and the T_g increases from 336.3℃ to 354.1℃. Using PAE with a molar fraction of 10% HAB as the resin matrix, a positive polyimide photoresist was formulated with diazine naphthoquinone (DNQ) and other components. After irradiation, development, and curing processes, the contrast of the photoresist pattern reaches 2.5, and the sensitivity of the photoresist is 80 mJ/cm². Meanwhile, a photoresist pattern with a resolution of 4 µm can be obtained on a silicon wafer.

This study aims to enhance the dielectric energy storage performance of poly(vinylidene fluoride) (PVDF) composite dielectrics. A new type of all-organic composite dielectric film (P-M) was prepared by filling different mass fraction of poly(methyl methacrylate) (PMMA) into PVDF by simple physical blending. The electric strength, energy storage density, and energy efficiency of composite dielectric films were systematically evaluated. Combining theoretical calculations and experimental characterization, the mechanism of electrostatic interactions between PVDF and PMMA molecular chains on energy storage performance of composite dielectric films was analyzed. The results show that the electric strength of the PVDF-based composite dielectric films with a PMMA mass fraction of 40% (P-M40) is 856.2 kV/mm, which is 59.0% higher compared to that of pure PVDF. The maximum energy storage density (U_e) of the P-M40 composite dielectric film is as high as 17.2 J/cm³, which is 40.9% higher than that of pure PVDF, and the charging and discharging efficiency (η) reaches 72.5%. Theoretical calculation reveals that there is an electrostatic interaction between the PVDF and PMMA molecular chains, which can regulate the arrangement and crystallization behavior of the PVDF molecular chains. Fourier transform infrared spectroscopy and X-ray diffraction analysis reveal that the introduction of PMMA promots the formation of the low-loss α phase, inhibits the generation of the β phase, and reduces the grain size of PVDF. Scanning electron microscopy shows that the microstructure of the composite dielectric film is denser, and the physical defects such as internal pores significantly decrease. These structural changes increase the carrier transport barrier, suppress the leakage current and conductivity loss, and improve the breakdown and energy storage performance of the composite dielectric film.

Conductive carbon black (CB) is a key component of shielding materials for high-voltage cables, and its structural characteristics have a decisive impact on the comprehensive performance of shielding materials. To address the issue of the deterioration of mechanical and processing properties of shielding materials caused by the high content of tradi-tional low-structural degree CB, this study prepared high-voltage cable shielding materials using ethylene-butyl acrylate copolymer (EBA) as the matrix and high-structural degree CB as the conductive filler. The electrical, mechanical, and processing properties of the shielding materials were systematically evaluated. The results show that high-structural degree CB has a significant advantage in constructing conductive networks due to its well-developed chain-like aggregates. The volume fraction percolation threshold of the shielding material is only 8.0%. When the high-structural degree CB mass fraction is 30%, the volume resistivity of the shielding material at 23℃ and 90℃ reaches 71 Ω·cm and 279 Ω·cm, respectively, and the elongation at break and tensile strength are 419% and 16.8 MPa, respectively, which meet the requirements of high-voltage cable standards. Compared with the shielding material added with a mass fraction of 35% low-structural degree CB, its maximum temperature rise and equilibrium torque during the mixing process decrease significantly, and the scorch resistance performance improves notably. Mechanistic analysis shows that high-structural degree CB enhances the filler network through physical cross-linking, increasing the storage modulus and complex viscosity of the shielding material. Meanwhile, the dense three-dimensional network structure formed by high-structural degree CB in the matrix inhibits the movement of EBA segments, resulting in a decrease in crystallinity.

Aiming at the problem that organic diluents in conventional superhydrophobic coatings are prone to cause environmental pollution and safety hazards, 1H,1H,2H,2H-perfluorodecyltriethoxysilane (FAS-17) was used to modify the surface of micro/nano silica (SiO₂) particles in this paper. A diluent free superhydrophobic anti-icing composite coating (RTV@Fn-SiO₂(11)#Fm-SiO₂) with macroscopic structure was prepared using room temperature vulcanized silicone rubber (RTV) as the substrate, and a macro-micro-nano multi-scale rough structure was constructed by knurling embossing technology, and its wettability, anti-icing performance, and environmental tolerance were systematically tested. The results show that the water contact angle of the prepared coating reaches (162.4±1.8)°, and the sliding angle is only (2.1±0.2)°, showing excellent superhydrophobic performance. In both dynamic and static icing tests, the coating demonstrates excellent anti-icing performance. The static ice formation time is extended to 1 292 s, which is 14 times that of the bare aluminum substrate, and the icing adhesion strength reduces significantly. After acid and alkali corrosion, ultraviolet ageing, tape stripping, and sandpaper wear resistance tests, the coating still maintains stable superhydrophobic performance. The diluent free superhydrophobic anti-icing composite coating with macrostructure has excellent anti-icing performance and envi-ronmental stability, which has potential application value for the protection of insulating equipment in power transmission systems.

Epoxy resin is extensively utilized in high-voltage power equipment and electronic encapsulation, but it is prone to microcracks under prolonged multi-field stresses, leading to insulation degradation and even equipment failure. Introducing self-healing microcapsules can effectively solve this problem, however conventional microcapsules have limitations such as strict triggering conditions, requiring external intervention, and the potential to damage the matrix. Therefore, this study designed a non-contact light-triggered microcapsule with urea-formaldehyde resin as the wall material and polyurethane acrylate oligomer as the core material. By embedding TiO₂ and SiO₂ nanoparticles with an average particle size of 200 nm into the wall material, an ultraviolet shielding layer was constructed, then the microcapsule was uniformly dispersed in the epoxy resin to prepare a composite material to achieve self-healing under natural light. The results show that the microcapsule structure remains intact at 210℃ and its thermal stability is excellent. When the mass fraction of microcapsules is 4%, the electric strength and dielectric performances of the composite materials are basically the same as those of the pure base material, with only a slight increase in tensile strength. After the damaged material is repaired, the recovery rate of tensile strength, electric strength at room temperature and high temperature, as well as volume resistivity all exceed 85%, the repair performance is excellent. This study provides a novel technical pathway to prolong the service life of epoxy resin insulating materials.

To explore the effect law of hydrothermal ageing on performances of epoxy resin, a hygrothermal resistant epoxy resin was prepared by blending highly reactive and thermally stable glycidylamine-type multifunctional epoxy resin (TGDDM) with bisphenol A-type epoxy resin (DGEBA) according to different mass rations in this paper. Different samples were subjected to 100℃ boiling water ageing experiments, and the performance degradation of the blended epoxy resin system and traditional epoxy resin system before and after ageing was analyzed from microscopic and macroscopic levels. Additionally, the mechanisms underlying the hydrothermal resistance of blended epoxy resin systems was analyzed by MS molecular dynamics simulation. The results show that when the mass ratio of DGEBA to TGDDM is 2∶1, the thermal-mechanical-electrical properties of D-MLB-2 system are better than those of traditional epoxy resins. Its glass transition temperature (T_g) is 174.2℃, the bending strength is 107.26 MPa, and the electric strength is 44.0 kV/mm. After 8 days of ageing, the T_g, bending strength, electric strength, and dielectric loss factor retention rate of the D-MLB-2 system are better than those of the conventional epoxy resin system. This research provides a theoretical basis for the development of hydrothermal resistant insulating materials and the exploration of hydrothermal ageing mechanisms.

With the increases of voltage level and main insulation thickness of high-voltage cable, the thermodynamic operating conditions of cross-linked polyethylene (XLPE) main insulation have become more complex. High-temperature thermal elongation performance is the key to evaluating the thermodynamic properties of XLPE. However, the mechanism research on the differences in thermal elongation performance of different XLPE samples remains insufficient. This paper aimed to comprehensively elucidate the underlying mechanism of thermal elongation performance differences of XLPE high voltage cables under different atmospheres. The thermal elongation performance of three kinds of domestic and international XLPE samples were measured under air, nitrogen, and vacuum atmospheres, and their differences in cross-linking density were analyzed. The cross-linking network structure of XLPE was characterized through gel content and molecular chain structure, and the thermal-oxidative ageing characteristics of XLPE were discussed combined with gel content, carbonyl content, and oxidation induction time. The results show that the high-temperature thermal elongation performance of XLPE is determined by its cross-linking network structure and thermal-oxidative ageing resistance. The XLPE with higher cross-linking density and better thermal-oxidative ageing resistance exhibits lower thermal elongation and permanent elongation. The thermal elongation test under air atmosphere will induce the thermal-oxidative ageing reaction of XLPE, resulting in the reduction of XLPE gel content and the increase of carbonyl content, which will destroy the cross-linked network structure, making the thermal elongation and permanent elongation of XLPE slightly higher. Conversely, the thermal elongation tests under vacuum or nitrogen atmospheres can prevent the damage of thermal-oxidative ageing to cross-linking network, and reflect the true crosslinking degree and thermodynamic properties of XLPE. This work can provide a more effective theoretical basis and testing method for assessing the thermodynamic performance of XLPE.

Oil-immersed power transformers are the core power transmission and transformation equipment in power systems. The internal oil-paper insulating materials of these transformers undergo deterioration such as moisture absorption and ageing during long-term operation, which seriously threatens the stable operation of the transformers. The AC conductivity behavior of oil-paper insulation composite system can effectively characterize the deterioration degree of the insulation. However, traditional AC conductivity calculation models of oil-paper insulation do not consider the effect of multiple relaxation processes in medium, resulting in low availability of these conventional models. In this paper, the frequency domain dielectric response measurements were performed on aged and damped oil-paper insulation samples at different test temperatures. A theoretical calculation model of AC conductivity variation characteristics in multiple relaxation process of oil-paper insulation system was constructed by means of relaxation and conductivity two shifting. The results show that after ageing, both the conductivity activation energy and relaxation activation energy of the oil-paper insulation decrease, while the effects of moisture on these two activation energy are opposite. The AC conductivities of oil-paper insulations with different ageing degrees at high frequency are basically consistent, and there is a significant transition area in the medium and high frequency ranges, while there is no smooth transition in the AC conductivity curve of the damped sample across the entire frequency range. Meanwhile, using the modified calculation model proposed in this paper can improve the accuracy of low-frequency AC conductivity calculation.

To address the stringent service requirements of AC contactor contact supports, linear phenolic resin was used for the blending modification of amino molding compounds. The effects of phenolic resin contents on mechanical properties, heat resistance, wear resistance, and electrical insulation properties of samples were investigated systematically. Fourier transform infrared spectroscopy (FTIR) and scanning electron microscopy (SEM) were employed to characterize the microstructure of samples, and the interaction between molding temperature and formulation was further explored. Meanwhile, the mechanical life tests of finished supports were carried out. The results show that within the range of phenolic resin mass fraction from 0% to 25%, condensation reaction occurs between phenolic resin and amino resin to form a semi-interpenetrating polymer network. When the mass fraction of phenolic resin is 15%, the comprehensive performance of the sample is the best. Its unnotched impact strength, flexural strength, deflection temperature under load, and power frequency electric strength increase by 47.9%, 41.1%, 69.1%, and 32.8%, respectively, compared with those of the pristine amino molding compound. Further increasing the content of phenolic resin, the mechanical properties of samples only slighty decrease. When the mass fraction of phenolic resin is 25%, the wear resistance of the sample is the best, and the average wear loss is 87.2% lower than that of the pure amino sample. Within the molding temperature range of 160-180℃, phenolic resin with a mass fraction of 15% and high-temperature curing has a synergistic effect on the molding compound. The modified materials prepared by using phenolic resins with a mass fraction of 15% or above are used to form the contactor's contact switch, and the mechanical life of the contactor can reach 12 million cycles, which can meet the requirements for long-term service.