Home Journals Articles Updates About
CN
image
收藏切换
Synthesis of polyimide containing biphenyl units and study on structure and properties of its photoresist
收藏切换
PDF
Jiaqi Hu, Yanqian Bu, Zhonggang Lu, Jie Dong*, Xin Zhao, Cuiqing Teng, Qinghua Zhang
Insulating Materials | 2026, 59(8) : 10 - 19
Less
收藏切换
Insulating Materials | 2026, 59(8): 10-19
• Material Research •
Synthesis of polyimide containing biphenyl units and study on structure and properties of its photoresist
Full
Jiaqi Hu, Yanqian Bu, Zhonggang Lu, Jie Dong*, Xin Zhao, Cuiqing Teng, Qinghua Zhang
Affiliations
  • 1College of Materials Science and Engineering, Donghua University, Shanghai 201620, China
  • 2State Key Laboratory of Advanced Fiber Materials, Donghua University, Shanghai 201620, China
Published: 2026-08-20 doi: 10.16790/j.cnki.1009-9239.im.2026.08.002
Outline
收藏切换

Taking the 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) as dianhydride monomer, and the fluorine-containing diamine 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (6FAP) and 3,3′-dihydroxybiphenylamine (HAB) as the diamine monomers, a series of polyamic acid (PAA) precursors were synthesized by regulating the molar ratio of 6FAP and HAB. Then, polyamic acid esters (PAE) were synthesized through imidization and esterification reactions, and a series of polyimide (PI) films containing biphenyl units were prepared through cyclization reactions. The thermodynamic properties of the PI films were studied. The results show that when the molar fraction of HAB is 10%, the CTE of the PI film decreases from 46.2×10-6 K-1 to 38.1×10-6 K-1, and the Tg increases from 336.3℃ to 354.1℃. Using PAE with a molar fraction of 10% HAB as the resin matrix, a positive polyimide photoresist was formulated with diazine naphthoquinone (DNQ) and other components. After irradiation, development, and curing processes, the contrast of the photoresist pattern reaches 2.5, and the sensitivity of the photoresist is 80 mJ/cm2. Meanwhile, a photoresist pattern with a resolution of 4 µm can be obtained on a silicon wafer.

polyimide  /  biphenyl unit  /  positive photoresist  /  photosensitive properties
Jiaqi Hu, Yanqian Bu, Zhonggang Lu, Jie Dong, Xin Zhao, Cuiqing Teng, Qinghua Zhang. Synthesis of polyimide containing biphenyl units and study on structure and properties of its photoresist[J]. Insulating Materials, 2026 , 59 (8) : 10 -19 . DOI: 10.16790/j.cnki.1009-9239.im.2026.08.002
Appendix
Less
Year 2026 volume 59 Issue 8
PDF
123
66
Cite this Article
BibTeX
Article Info
doi: 10.16790/j.cnki.1009-9239.im.2026.08.002
  • Receive Date：2025-07-31
  • Online Date：2026-09-10
  • Published：2026-08-20
Article Data
Affiliations
History
  • Received：2025-07-31
  • Revised：2025-09-22
Affiliations
    1College of Materials Science and Engineering, Donghua University, Shanghai 201620, China
    2State Key Laboratory of Advanced Fiber Materials, Donghua University, Shanghai 201620, China
References
Share
https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2026.08.002
Share to
QR

Scan QR to access full text

Cite this article
BibTeX
Citations
表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
关闭全屏
  • BibTeX
  • EndNote
  • RefWorks
  • TxT
Links
Articles
Latest Articles
Most Read
Collections
Updates
Events
News
Multimedia
About
About Us
Contact
No. 86 Xueyuan South Road, Haidian District, Beijing
100081
010-62199257
qkjq@cast.org.cn

Copyright © 2025 China Association for Science and Technology. All rights reserved. For all open access content, the relevant licensing terms apply.
Sponsored by the Office of the Leading Group for Cybersecurity and Informatization of CAST, and supported by Science and Technology Review Publishing House