Journal of Power Supply ›› 2024, Vol. 22 ›› Issue (3) : 72 - 77. DOI: 10.13234/j.issn.2095-2805.2024.3.72
Packaging Design and Optimization

Design and Development of 1 200 A IGBT Power Module with EconoDUAL Packaging and 800 V Bus Voltage

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The hierarchy quorum sensing network in Pseudomonas aeruginosa
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