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Design and Development of 1 200 A IGBT Power Module with EconoDUAL Packaging and 800 V Bus Voltage
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Xiaoshuang HUI1, 2, 3, Puqi NING1, 2, 3, Tao FAN1, 2, 3, Xinhua GUO4, Jinyuan FU, Ke HUANG5
Journal of Power Supply | 2024, 22(3) : 72 - 77
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Journal of Power Supply | 2024, 22(3): 72-77
• Packaging Design and Optimization •
Design and Development of 1 200 A IGBT Power Module with EconoDUAL Packaging and 800 V Bus Voltage
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Xiaoshuang HUI1, 2, 3, Puqi NING1, 2, 3, Tao FAN1, 2, 3, Xinhua GUO4, Jinyuan FU, Ke HUANG5
Affiliations
  • 1 University of Chinese Academy of Sciences Beijing 100049 China
  • 2 Institute of Electrical Engineering, Chinese Academy of Sciences Beijing 100190 China
  • 3 Institute of Electrical Engineering, Chinese Academy of Sciences Key Laboratory of Power Electronics and Electric Drive Beijing 100190 China
  • 4 Huaqiao University Xiamen 362021 China
  • 5 Zhejiang Xinfeng Technology Co., Ltd Taizhou 317700 China
Published: 2024-05-30 doi: 10.13234/j.issn.2095-2805.2024.3.72
Outline
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Enhancing the power density of vehicle-grade power modules is of significance for the performance of electric vehicles. The two-dimensional layout used in conventional power modules results in large parasitic inductance, which limits the switching speed and bus voltage and further affects the increase in power density. To solve this problem, an IGBT power module with EconoDUAL packaging was taken as the research object, and a three-dimensional layout was designed using the stacked DBC method to develop a 1 200 V/1 200 A IGBT power module. The layout structure of the proposed power module was introduced in detail. Compared with those obtained using the conventional two-dimensional layout methods, the parasitic inductance decreased by 58%. Additionally, electrical performance tests including a double-pulse test with pulse current of 1 200 A under bus voltage of 800 V were conducted on the power module, thereby verifying the improved power density of the module. To maintain the heat dissipation performance while increasing the power density,

Power module  /  electric vehicle  /  IGBT  /  parasitic inductance  /  thermal resistance
Xiaoshuang HUI, Puqi NING, Tao FAN, Xinhua GUO, Jinyuan FU, Ke HUANG. Design and Development of 1 200 A IGBT Power Module with EconoDUAL Packaging and 800 V Bus Voltage[J]. Journal of Power Supply, 2024 , 22 (3) : 72 -77 . DOI: 10.13234/j.issn.2095-2805.2024.3.72
Funding
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  • National Key Research and Development Program of China(2021YFB2500600)
  • CAS Youth Multi-discipline Project(JCTD-2021-09)
Appendix
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Year 2024 volume 22 Issue 3
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349
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Article Info
doi: 10.13234/j.issn.2095-2805.2024.3.72
  • Receive Date：2024-01-31
  • Online Date：2025-07-21
  • Published：2024-05-30
Article Data
Affiliations
History
  • Received：2024-01-31
  • Revised：2024-02-15
  • Accepted：2024-02-19
Funding
National Key Research and Development Program of China(2021YFB2500600)
CAS Youth Multi-discipline Project(JCTD-2021-09)
Affiliations
    1 University of Chinese Academy of Sciences Beijing 100049 China
    2 Institute of Electrical Engineering, Chinese Academy of Sciences Beijing 100190 China
    3 Institute of Electrical Engineering, Chinese Academy of Sciences Key Laboratory of Power Electronics and Electric Drive Beijing 100190 China
    4 Huaqiao University Xiamen 362021 China
    5 Zhejiang Xinfeng Technology Co., Ltd Taizhou 317700 China
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