This paper designs a miniaturized ultra-wideband variable frequency converter for the Ka -band and focuses on breaking through key technologies for advanced packaging for the Ka-band. In this paper, a ball grid array(BGA) three-dimensional packaging technique is used to achieve multi-chip integration, and a multi-channel wavelength converter compensation circuit for Ka-band is designed, and the vertical transmission of Ka frequency radio signals by BGA within the 32 to 38 GHz band is successfully achieved, further improving the integration of the packaging. A high performance 3D substrate-integrated transmission structure is designed to meet the need of high isolation for interconnection between 3D package modules. For the long-distance coaxial transmission structure, a hierarchical compensation design is adopted to ensure the transmission performance, the plane size of the interconnection structure is reduced by 70% and the inter-line isolation is increased by more than 30 dB. The test results show that the technical specifications of the frequency conversion module are basically consistent with the design results, which provides important guidance and reference for the application of advanced packaging technology in ultra-wideband millimeter wave band.
| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |