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In this paper, the advantages of the gold ribbon welding connection technology over solder connection technology are described, and the effects of different sizes and positions of gold ribbon welding on electrical transmission performance were analyzed by simulation technology. Through a series of orthogonal tests, the paper shows how the three parameters of spot welding voltage, spot welding time and electrode pressure affected the welding effect during the spot welding process between gold strip and substrate and adapter. The formation mechanism of different fracture modes and the mechanism of smoke generation were analyzed, and the relationship between single parameter and welding breaking force is revealed. Finally, the optimized process parameters are obtained. The optimized process parameters were used to produce the gold ribbon according to the specified process steps, and the excellent performance of the ribbon was verified by the high and low temperature cycle test and the electrical property test.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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