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Packaging reliability of control chips, which serve as the central components of Electronic Control Units (ECUs), directly affects the safety performance of automobiles. This paper systematically investigates the mechanism of delamination failure of two mainstream ECU architectures namely Microcontroller Unit (MCU) and System-on-Chip (SoC) based on composite load characteristics of mechanical vibration and temperature shock under typical conditions of automobile. The research results indicate that under multi-load coupling, interface bonding strength attenuation and thermal mismatching of materials caused by performance degradation of key positions like die attach interface, wire bond interface and underfill packing layer are the primary factors inducing delamination failure. This paper compares the application of three finite element analysis techniques—Virtual Crack Closure Technique (VCCT), J-integral, and Cohesive Zone Model (CZM), which indicates that CZM has interface representational dominance under large deformation condition of nonlinear material, while J-integral is applicable to small deformation fracture zone of nonlinear material, and VCCT has advantages in computational efficiency in the analysis of linear elastic steady-state crack propagation.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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