Automobile Technology & Material

Automobile Technology & Material ›› 2025, Vol. ›› Issue (7) : 19 - 30. DOI: 10.19710/J.cnki.1003-8817.20240166

Research Progress of Automotive-Grade Chip Package Interfaces Reliability

Fanghui Sheng ¹ ,
Pengjian Liang ² ,
Baoguang Ma ² ,
Jinglei Yang ³ ,
Enqi Dai ⁴ ,
Xingsen Li ¹

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The hierarchy quorum sensing network in Pseudomonas aeruginosa

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Issue Date
2025-11-03