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Study on Interface Thermal Conductivity of Boron Nitride/Low Density Polyethylene Composite Materials Based on Scanning Thermal Microscopy
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Chengxiang CHEN1, Lingjie ZHU1, 2, Beibei JIA1, Yongfei LI1, Yingye JIANG3, Jun ZHOU1, Kai WU1
Insulating Materials | 2021, 54(6) : 18 - 25
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Insulating Materials | 2021, 54(6): 18-25
Special Issue on Thermal Conductive Insulating
Study on Interface Thermal Conductivity of Boron Nitride/Low Density Polyethylene Composite Materials Based on Scanning Thermal Microscopy
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Chengxiang CHEN1, Lingjie ZHU1, 2, Beibei JIA1, Yongfei LI1, Yingye JIANG3, Jun ZHOU1, Kai WU1
Affiliations
  • 1Xi'an Jiaotong University, Xi'an 710049, China
  • 2Changzhou Power Supply Company of State Grid Jiangsu Electric Power Co., Ltd., Changzhou 213003, China
  • 3Shenzhen Power Supply Co., Ltd., China Southern Power Grid, Shenzhen 518048, China
Published: 2021-06-20 doi: 10.16790/j.cnki.1009-9239.im.2021.06.003
Outline
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The interface of thermal conductive polymer composite matrix and filler can affect the overall thermal conductivity of the composite. However, limited by traditional testing technologies, it is difficult to study the interface thermal conduction mechanism from microscopic view. In this paper, the interface thermal conduction mechanism of boron nitride (BN)/low density polyethylene (LDPE) composites was studied by scanning thermal microscope (SThM), and the interface thermal properties of the BN/LDPE composites were analyzed quantitatively. The test process of SThM was simulated by finite element analysis, and the interface thermal conduction process at the inorganic-organic interface was revealed. The results show that with the increase of BN content, the thermal conductivity of the composite increases. When the mass fraction of the BN reaches 20%, the thermal conductivity of the composite increases by 22%. The sample morphology in micro-nano scale and the voltage distribution image reflecting the thermal properties were obtained by SThM, it is found that the thermal conductivity interface width of the BN/LDPE composite is 150–200 nm. At the area that two BN particles are in contact with each other, the high thermal conductivity area increases, and the thermal conductivity interface width changes little. The fitting curve between thermal conductivity and the square of output voltage is obtained by testing the standard samples, and the interface thermal conductivity of the BN/LDPE composites is calculated to be 0.33–39.81 W/(m·K). The simulation results show that the probe tip can distinguish the filler, interface, and matrix, and the thermal conductivity of the composite increases with the increase of the interface width and thermal conductivity.

SThM  /  LDPE-based composites  /  interface thermal transfer  /  finite element simulation
Chengxiang CHEN, Lingjie ZHU, Beibei JIA, Yongfei LI, Yingye JIANG, Jun ZHOU, Kai WU. Study on Interface Thermal Conductivity of Boron Nitride/Low Density Polyethylene Composite Materials Based on Scanning Thermal Microscopy[J]. Insulating Materials, 2021 , 54 (6) : 18 -25 . DOI: 10.16790/j.cnki.1009-9239.im.2021.06.003
Year 2021 volume 54 Issue 6
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2021.06.003
  • Receive Date:2020-11-28
  • Online Date:2026-03-03
  • Published:2021-06-20
Article Data
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History
  • Received:2020-11-28
  • Revised:2021-02-22
Funding
Affiliations
    1Xi'an Jiaotong University, Xi'an 710049, China
    2Changzhou Power Supply Company of State Grid Jiangsu Electric Power Co., Ltd., Changzhou 213003, China
    3Shenzhen Power Supply Co., Ltd., China Southern Power Grid, Shenzhen 518048, China
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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