Insulating Materials ›› 2021, Vol. 54 ›› Issue (6) : 18 - 25. DOI: 10.16790/j.cnki.1009-9239.im.2021.06.003
Special Issue on Thermal Conductive Insulating

Study on Interface Thermal Conductivity of Boron Nitride/Low Density Polyethylene Composite Materials Based on Scanning Thermal Microscopy

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The hierarchy quorum sensing network in Pseudomonas aeruginosa
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