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Polyimide (PI) is a class of insulating materials with great potential in the field of high-voltage and high-power device encapsulation, which has excellent insulating properties. However, its intrinsic thermal conductivity is low, which is easy to cause localized overheating and damage to the device. In this paper, the thermal conductivity of polyimide materials was improved by doping with thermal conductive fillers. PI/c-BN and PI/h-BN composite films were prepared by in situ polymerization with cubic boron nitride (c-BN) and hexagonal boron nitride (h-BN) as filler, and the effects of different content of c-BN and h-BN on the thermal conductivity, thermal stability, and mechanical properties of the composite films were investigated. The results show that the thermal conductivity of the composite films increases with the increase of BN content. The thermal conductivity of PI/c-BN composite films is higher than that of PI/h-BN composite films within the studied content, and the thermal conductivity of PI/40c-BN composite films increases by 1 068% compared to pure PI. The thermal conductivity of PI matrix is improved by c-BN at lower content, and the tensile strength of PI/c-BN composite films still reaches 40 MPa when the filler mass fraction is 30%. In addition, the thermal stability of the composite films is improved.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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