Insulating Materials ›› 2025, Vol. 58 ›› Issue (6) : 25 - 34. DOI: 10.16790/j.cnki.1009-9239.im.2025.06.004
Special Issue on High Performance Polyimide Materials

Thermal conductive polyimide composite films filled by cubic boron nitride

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The hierarchy quorum sensing network in Pseudomonas aeruginosa
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