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Electrically conductive adhesive, a special functional adhesive, has been widely used in the fields of integrated circuit bonding, light-emitting diode manufacturing, chip packaging, and solar panel production due to its excellent line resolution, environmental friendliness, and simple operation process. In recent years, with the rapid development of electronic products, 5G, artificial intelligence and other emerging technologies, preparation of high-performance electrically conductive adhesives has become a key research direction and industry development trend in the field of electronic materials today. Herein, the basic composition, types as well as advantages and disadvantages of electrically conductive adhesives were reviewed, followed by introduction on the conductive mechanism. The improvement strategies for the mechanical bonding performance of electrically conductive adhesives were then elaborated for the aspects of modified resin matrix and doped nanomaterials, while strategies for electrical conductivity enhancement were summarized from regulation on the type, size and morphology of conductive fillers, nanoparticle addition, surface modification of conductive fillers, doping of low-melting-point alloys and optimization of curing conditions. Finally, the current development status and the existing problems of domestic conductive adhesives were pointed out and their future development trends were discussed.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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