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Thermal Conductivity of AlN/Diamond Composites Sintered under High-Pressure and High-Temperature
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Fa GONG1, Wenjia LIANG2, Qiming WANG1, Qian LI1, Hongwen LIU1, Peihong HE1, Duanwei HE1, Fang PENG1
Chinese Journal of High Pressure Physics | 2026, 40(9) : 090111-1 - 090111-11
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Chinese Journal of High Pressure Physics | 2026, 40(9): 090111-1-090111-11
• Carbon under High Pressure •
Thermal Conductivity of AlN/Diamond Composites Sintered under High-Pressure and High-Temperature
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Fa GONG1, Wenjia LIANG2, Qiming WANG1, Qian LI1, Hongwen LIU1, Peihong HE1, Duanwei HE1, Fang PENG1
Affiliations
  • 1Institute of Atomic and Molecular Physics, Sichuan University, Chengdu 610065, Sichuan, China
  • 2School of Intelligent Manufacturing, Sichuan University of Arts and Science, Dazhou 635002, Sichuan, China
Published: 2026-09-05 doi: 10.11858/gywlxb.20261071
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Aluminum nitride (AlN) ceramics are important heat-dissipation materials for high-power electronic devices. However, the high sintering temperature required by conventional processing routes limits practical application of AlN ceramics and increases fabrication costs. Therefore, it is necessary to develop preparation method that is capable of achieving densification at relatively low temperature. To address the difficulty of simultaneously obtaining high densification and high thermal conductivity in polycrystalline AlN ceramics under reduced-temperature sintering conditions, this work adopts a stepwise research strategy. First, the densification behavior and thermal conductivity of pure AlN under high-pressure assistance were investigated to identify the optimal sintering conditions. Under additive-free conditions, pure-phase AlN ceramics with clean grain boundaries and high densification were prepared at 5.0 GPa and 1400 ℃, achieving a thermal conductivity of 101.6 W/(m·K). Based on these optimized conditions, the AlN/diamond composite system was further studied, and the effects of diamond volume fraction on the structure and properties of the composites were systematically examined. The results show that the thermal conductivity of the composites first decreases and then increases with increasing diamond volume fraction, reaching 112.4 W/(m·K) at 33.3%. Mechanistic analysis indicates that interfacial thermal resistance dominates at low diamond contents, whereas at high diamond contents the enhancement of heat transport by thermally conductive diamond pathways becomes more significant. By taking full advantage of the processing benefits of high-temperature and high-pressure technology, this work achieves substantial improvement of AlN-based materials at temperatures lower than those required in conventional sintering, thereby providing a new route for the low-temperature fabrication of high-performance thermally conductive ceramics.

aluminum nitride ceramics  /  diamond  /  high-temperature and high-pressure  /  high-pressure sintering  /  thermal conductivity
龚发, 梁文嘉, 王齐明, 李倩, 刘洪汶, 何沛宏, 贺端威, 彭放. 高温高压烧结AlN/金刚石复合材料的导热性. 高压物理学报, 2026 , 40 (9) : 090111-1 -090111-11 . DOI: 10.11858/gywlxb.20261071
Fa GONG, Wenjia LIANG, Qiming WANG, Qian LI, Hongwen LIU, Peihong HE, Duanwei HE, Fang PENG. Thermal Conductivity of AlN/Diamond Composites Sintered under High-Pressure and High-Temperature[J]. Chinese Journal of High Pressure Physics, 2026 , 40 (9) : 090111-1 -090111-11 . DOI: 10.11858/gywlxb.20261071
Year 2026 volume 40 Issue 9
9
4
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Article Info
doi: 10.11858/gywlxb.20261071
  • Receive Date:2026-04-02
  • Online Date:2026-11-05
  • Published:2026-09-05
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  • Received:2026-04-02
  • Revised:2026-04-24
Affiliations
    1Institute of Atomic and Molecular Physics, Sichuan University, Chengdu 610065, Sichuan, China
    2School of Intelligent Manufacturing, Sichuan University of Arts and Science, Dazhou 635002, Sichuan, China
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表12种不同金属材料的力学参数
科
Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)
属
Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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