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Outline
Voronoi method was adopted to establish the micro-geometry model of polycrystalline copper which can reflect the irregularities of grain geometric shape and grain boundaries. The Tie-Break model was used to reflect the binding characteristics of grain boundary. Then the grains deformation and thermal deposition behavior under explosive dynamic loading were studied from the microscopic view recur to LS-DYNA nonlinear finite element program. Finally, the possibility of grain refining was anslyzed by high pressure melting point theory and grain growth theory, and the analysis was proved qualitatively by experimental results. The results show that it is feasible to research grain and grain boundary deformation mechanisms as well as the heat deposition for the shock compressed polycrystalline copper by the numerical simulation method built in this work. Stress concentration is easy to form on the grain boundaries, plastic deformation and temperature rise on the grain boundaries are greater than those of the grain interior. The temperature rise caused by the macro-adiabatic compression and the micro-plastic deformation does not cause grain growth.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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