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Interference on Logic Chips due to Plasma Created byHypervelocity Impact on 2024-T4 Aluminum Target
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En-Ling TANG1, Qing-Ming ZHANG2, Meng WANG1, Sheng-Hai XIANG1, Wei ZHANG1, Ming-Hai YANG1, Le-Xin LI1, Hui YU1, Rong-Mei LUO1, Xin-Ying ZHAO1
Chinese Journal of High Pressure Physics | 2013, 27(1) : 113 - 118
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Chinese Journal of High Pressure Physics | 2013, 27(1): 113-118
Interference on Logic Chips due to Plasma Created byHypervelocity Impact on 2024-T4 Aluminum Target
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En-Ling TANG1, Qing-Ming ZHANG2, Meng WANG1, Sheng-Hai XIANG1, Wei ZHANG1, Ming-Hai YANG1, Le-Xin LI1, Hui YU1, Rong-Mei LUO1, Xin-Ying ZHAO1
Affiliations
  • 1.School of Equipment Engineering, Shenyang Ligong University, Shenyang 110159, China
  • 2.State Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology, Beijing 100081, China
Published: 2013-02-15
Outline
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To acquire the interference status of typical logic chips in spacecraft caused by plasma generated from a hypervelocity impact, the triple Langmuir probe system established by selfishness is used for diagnostics of plasma characteristic parameters created by 2024-T4 aluminum projectile hypervelocity impact on 2024-T4 aluminum target, with the impact velocity and incidence angle of 6.10 km/s and 30°, respectively. The plasma electron density is measured at a given position with a given azimuth, and the interference estimation is performed for logic chip by data acquisition system. The experimental results show that the logic chips in spacecraft will be seriously influenced by plasma generated at hypervelocity impact.

hypervelocity impact  /  plasma  /  logic chip  /  electromagnetic interference
唐恩凌, 张庆明, 王猛, 相升海, 张薇, 杨明海, 李乐新, 于辉, 罗荣梅, 赵新颖. 超高速碰撞2024-T4铝靶产生的等离子体对逻辑芯片的干扰. 高压物理学报, 2013 , 27 (1) : 113 -118 .
En-Ling TANG, Qing-Ming ZHANG, Meng WANG, Sheng-Hai XIANG, Wei ZHANG, Ming-Hai YANG, Le-Xin LI, Hui YU, Rong-Mei LUO, Xin-Ying ZHAO. Interference on Logic Chips due to Plasma Created byHypervelocity Impact on 2024-T4 Aluminum Target[J]. Chinese Journal of High Pressure Physics, 2013 , 27 (1) : 113 -118 .
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Article Info
  • Receive Date：2011-10-05
  • Online Date：2026-11-05
  • Published：2013-02-15
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History
  • Received：2011-10-05
  • Revised：2011-11-02
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Affiliations
    1.School of Equipment Engineering, Shenyang Ligong University, Shenyang 110159, China
    2.State Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology, Beijing 100081, China
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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