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Outline
Axisymmetric unit cell model calculations are used to study void growth in a material containing a periodic array of spherical voids under different loading rate rates. Numerical results show that: (1) Micro-inertia is found to have a strong stabilizing effect on void growth process; (2) The growth rate of void increases with the square root of mean stress; (3) Accounting for micro-inertia effect on void growth and percolation stress relaxation during the void-coalescence process, a simple dynamic damage evolution model is proposed for elastic-rigid-perfectly plastic materials; (4) By using of the proposed model the spall tests on copper under different impact velocities are simulated, and the numerical predictions are in good agreement with the experimental measurements, verifying the model applicability.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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