Full
Outline
In order to simulate and study the oblique hypervelocity impacts of space debris on bumper of spacecrafts, a series of oblique hypervelocity impact experiments of aluminum Whipple shields are carried out by a two-stage light gas gun. The aluminum alloy projectile diameter is 3.97 mm, the impact velocities range from 1.14 to 5.35 km/s, and the impact angles range from 0° to 70°. The crater distributions on the rear wall of aluminum Whipple shield obliquely impacted by aluminum spheres are obtained and analyzed. In addition, the forecast equations for crater distribution on the rear wall of aluminum Whipple shield by oblique hypervelocity impact are derived. The results indicate that there are two crater distribution areas on the rear wall under hypervelocity oblique impact. The critical fragmentation velocity of projectile will bring effect on the relationship between the impact damage law of rear wall and impact angle. For aluminum alloy Whipple shield, there exists a critical initial collision angle at which the impact damage on the rear wall is the most severe.
3
0
| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
关闭全屏
No. 86 Xueyuan South Road, Haidian District, Beijing
010-62662699(Operation and Technical Support)
qkjq@cast.org.cn
Copyright © 2025 China Association for Science and Technology. All rights reserved. For all open access content, the relevant licensing terms apply.
Sponsored by the Office of the Leading Group for Cybersecurity and Informatization of CAST, and supported by Science and Technology Review Publishing House
