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Calculation of Shock Temperature by Considering Electronic Contribution
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Xian-Wen RAN1, 2, Wen-Hui TANG1, Hua TAN2, Cheng-Da DAI2
Chinese Journal of High Pressure Physics | 2006, 20(2) : 153 - 156
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Chinese Journal of High Pressure Physics | 2006, 20(2): 153-156
Calculation of Shock Temperature by Considering Electronic Contribution
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Xian-Wen RAN1, 2, Wen-Hui TANG1, Hua TAN2, Cheng-Da DAI2
Affiliations
  • 1.Physical Institute of Technology, College of Science, National University of Defense Technology, Changsha 410073, China
  • 2.Laboratory for Shock Wave and Detonation Physics, Institute of Fluid Physics, CAEP, Mianyang 621900, China
Published: 2006-06-05
Outline
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Basing on the former shock temperature calculation methods, a new method was proposed, which considered the electronic contribution and successfully avoided the difficulties of calculating 0 K EOS of materials. By applying it to aluminum and copper, the results were well consistent with experimental data. And the calculated onset of melting on the Hugoniot curves of aluminum and copper were (125.5 GPa, 4 705 K) and (231 GPa, 5 369 K), respectively, in good agreement with the presented experimental data of aluminum and copper.

shock temperature  /  shock induced melting point  /  equation of state  /  high pressure and high temperature
冉宪文, 汤文辉, 谭华, 戴诚达. 含电子影响的冲击温度计算. 高压物理学报, 2006 , 20 (2) : 153 -156 .
Xian-Wen RAN, Wen-Hui TANG, Hua TAN, Cheng-Da DAI. Calculation of Shock Temperature by Considering Electronic Contribution[J]. Chinese Journal of High Pressure Physics, 2006 , 20 (2) : 153 -156 .
Appendix
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Year 2006 volume 20 Issue 2
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Article Info
  • Receive Date：2005-04-18
  • Online Date：2026-11-01
  • Published：2006-06-05
Article Data
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History
  • Received：2005-04-18
  • Revised：2005-05-23
Funding
Affiliations
    1.Physical Institute of Technology, College of Science, National University of Defense Technology, Changsha 410073, China
    2.Laboratory for Shock Wave and Detonation Physics, Institute of Fluid Physics, CAEP, Mianyang 621900, China
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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