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Two different W interlay/substrate bonding interfaces for the adhesion of diamond film deposited on WC-Co substrate were investigated using bias enhancing nucleation method, in microwave plasma enhanced chemical vapor deposition (MWCVD) device. The results indicate that hydrogen plasma decarburization, W interlayer sputtering, recarburization with negative biasing induce chemical reaction bonding interface formed between the W interlayer and the substrate. Recarburized W interlayer in the initial diamond deposition strongly adhere to WC grains on the surface of WC-Co substrate, and consequently improved the adhesion of diamond film on WC-Co substrate. This pretreatment improved the adhesion of diamond film more obvious, compared with sputtering W interlayer directly on the substrate, in which physical bonding interlayer formed. Carburization with high negative biasing can improve the roughness of the substrate surface, and consequently improve the effect of mechanical interlock. The nucleation density was increased by negative biasing and therefore improved the contact area between the diamond film and the substrate, consequently improved the adhesion of diamond film on WC-Co substrate.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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