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Metallic Hydrogen Ligand Compounds: A Potential Route to Superconducting Metallic Hydrogen at Ambient Pressure
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Zihan ZHANG1, Defang DUAN2, *, Tian CUI2, 3, *
Chinese Journal of High Pressure Physics | 2026, 40(4) : 040106-1 - 040106-8
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Chinese Journal of High Pressure Physics | 2026, 40(4): 040106-1-040106-8
Young Scientists’ Forum
Metallic Hydrogen Ligand Compounds: A Potential Route to Superconducting Metallic Hydrogen at Ambient Pressure
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Zihan ZHANG1, Defang DUAN2, *, Tian CUI2, 3, *
Affiliations
  • 1Department of Physics and Astronomy, Uppsala University, Uppsala 75120, Sweden
  • 2State Key Laboratory of Superhard Materials, Key Laboratory of Material Simulation Methods & Software of Ministry of Education, College of Physics, Jilin University, Changchun 130012, Jilin, China
  • 3Institute of High Pressure Physics, School of Physical Science and Technology, Ningbo University, Ningbo 315211, Zhejiang, China
Published: 2026-04-05 doi: 10.11858/gywlxb.20251216
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Metallic hydrogen, with its properties including room-temperature superconductivity and quantum fluidity, is known as the holy grail of high-pressure physics. However, since atomic metallic hydrogen requires pressures about 500 GPa, it has not been realized in experiments since its conception in 1935. To take advantage of properties the properties of metallic hydrogen in the future, it will be crucial to obtain it at ambient pressure. Current approaches to obtaining metallic hydrogen at low pressures rely on the “chemical precompression” in hydrides to induce metallization of hydrogen at low pressures, essentially identifying superconducting hydrides that can host the properties of metallic hydrogen. However, these superconducting hydrides currently lack distinct structural features, complicating the search for metallic hydrogen hosts. Here, we identify metallic hydrogen ligand compounds with hydrogen as the ligands as potential hosts for properties of metallic hydrogen at low pressures. The metallization of the non-bonding orbitals of the hydrogen ligands is a key criterion for determining whether a metallic hydrogen ligand compound can host metallic hydrogen properties. This article summarizes the main behaviors of hydrogen at ambient pressure, focusing on hydrogen ligand compounds at ambient pressure. Then, using a simple model of a one-dimensional hydrogen atom chain, we analyzed the causes of non-bonding orbital metallization and the physical picture of reduced stability pressure. The orbital characteristics of metallic hydrogen ligand compounds are then analyzed, highlighting their rules of superconductivity, topological properties, and the electronic structure that enable metallization. The analysis of metallic hydrogen ligand compounds presented in this article not only provides important structural information for future exploration of metal hydride superconductors but also provides an important theoretical foundation for realizing the properties of metallic hydrogen at ambient pressure.

metallic hydrogen  /  superconducting hydrides  /  electronic structure  /  chemical precompression
Zihan ZHANG, Defang DUAN, Tian CUI. Metallic Hydrogen Ligand Compounds: A Potential Route to Superconducting Metallic Hydrogen at Ambient Pressure[J]. Chinese Journal of High Pressure Physics, 2026 , 40 (4) : 040106-1 -040106-8 . DOI: 10.11858/gywlxb.20251216
Year 2026 volume 40 Issue 4
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doi: 10.11858/gywlxb.20251216
  • Receive Date:2025-09-28
  • Online Date:2026-04-29
  • Published:2026-04-05
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History
  • Received:2025-09-28
  • Revised:2025-10-16
Affiliations
    1Department of Physics and Astronomy, Uppsala University, Uppsala 75120, Sweden
    2State Key Laboratory of Superhard Materials, Key Laboratory of Material Simulation Methods & Software of Ministry of Education, College of Physics, Jilin University, Changchun 130012, Jilin, China
    3Institute of High Pressure Physics, School of Physical Science and Technology, Ningbo University, Ningbo 315211, Zhejiang, China
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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