Thermal Transport Engineering of Several Emerging Thermoelectric Materials and Thermal Logic Devices
1.Department of Materials Science and Engineering, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China
2.CAS Key Laboratory of Mechanical Behavior and Design of Materials and Department of Precision Machinery and Instrumentation, University of Science and Technology of China, Hefei 230026, China
3.University of Science and Technology of China, Hefei 230026, China
4.Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China
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ZHAN Ruonan (1997-), female, Master candidate. E-mail: zhanruonan1997@163.com
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