CHEN Yijing (1996-), female, Master candidate. E-mail: YCHEN231@163.com
Glass is widely used in sealing and connection of various optoelectronic devices due to its favorable heat resistance, excellent electrical insulation, and adjustable expansion coefficient. This review briefly represented the interaction mechanism between sealing glass and substrate materials, such as glass, ceramics, metal, silicon wafer, etc.. Besides, recent development on sealing glass in new energy devices, photoelectronics and other applications, such as silicon solar cell electrode, organic light-emitting diode, solid oxide fuel cell, was described. In addition, the critical research and key issues of sealing glass were also discussed. The related applications and future development of sealing glass were summarized and prospected.
| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |