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Effect of Oscillatory Pressure on Sintering Densification of High Quality Silicon Nitride Ceramics
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Yao HAN1, Haiyan LI2, Zhipeng XIE3, Huadong WANG1, Heng DONG1, Zhiqiang SUN1, Bingqing ZHANG1, Jian ZHANG1, Yi LV1
Journal of the Chinese Ceramic Society | 2021, 49(4) : 673 - 680
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Journal of the Chinese Ceramic Society | 2021, 49(4): 673-680
Effect of Oscillatory Pressure on Sintering Densification of High Quality Silicon Nitride Ceramics
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Yao HAN1, Haiyan LI2, Zhipeng XIE3, Huadong WANG1, Heng DONG1, Zhiqiang SUN1, Bingqing ZHANG1, Jian ZHANG1, Yi LV1
Affiliations
  • 1.Aerospace Institute of Advanced Materials & Processing Technology, Beijing 100074, China
  • 2.China Building Material Test & Certification Group Co., Ltd, Beijing 100024, China
  • 3.State Key Laboratory of New Ceramics and Fine Processing, Tsinghua University, Beijing 100084, China
  • HAN Yao (1990-), male, Ph.D., Engineer. E-mail:

About Author:

HAN Yao (1990-), male, Ph.D., Engineer. E-mail:

Published: 2021-04-20 doi: 10.14062/j.issn.0454-5648.20200636
Outline
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Oscillatory pressure sintering (OPS) technique was used to prepare silicon nitride ceramics with high quality. In comparison with hot pressure (HP) sintering process, the density, phase, grain size, aspect ratio and microstructure of silicon nitride ceramics by two methods were further investigated. The densification effect of oscillatory pressure on silicon nitride ceramics were studied. The results indicate that the silicon nitride ceramic has reached a complete phase transition from α phase to β phase under OPS process and its relative density has reached 99.82%. The grain sizes of OPS specimen are significantly increased compared with the specimen prepared by HP process. The average aspect ratio of the grains has increased from 3.79 to 4.86 when the fabricated process changed from HP to OPS. Bending strength, hardness and fracture toughness reached 1 333 MPa, 16.2 GPa, 12.1 MPa·m1/2, respectively. Fracture surface energy also increased with the introduction of oscillatory pressure. In addition, obvious deformation streaks and dislocation movement areas are observed through TEM analysis. Obviously, the application of oscillatory pressure improves the densification rate and the growth driving force of grains. The plastic deformation of silicon nitride during the densification process were also found. Thereby, the sintering densification process was accelerated.

silicon nitride  /  densification  /  oscillatory pressure  /  sintering  /  grain size  /  microstructure
韩耀, 李海燕, 谢志鹏, 王华栋, 董衡, 孙志强, 张冰清, 张剑, 吕毅. 振荡压力对高性能氮化硅陶瓷烧结致密化的影响. 硅酸盐学报, 2021 , 49 (4) : 673 -680 . DOI: 10.14062/j.issn.0454-5648.20200636
Yao HAN, Haiyan LI, Zhipeng XIE, Huadong WANG, Heng DONG, Zhiqiang SUN, Bingqing ZHANG, Jian ZHANG, Yi LV. Effect of Oscillatory Pressure on Sintering Densification of High Quality Silicon Nitride Ceramics[J]. Journal of the Chinese Ceramic Society, 2021 , 49 (4) : 673 -680 . DOI: 10.14062/j.issn.0454-5648.20200636
Year 2021 volume 49 Issue 4
25
8
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Article Info
doi: 10.14062/j.issn.0454-5648.20200636
  • Receive Date:2020-08-23
  • Online Date:2026-10-30
  • Published:2021-04-20
Article Data
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History
  • Received:2020-08-23
  • Revised:2020-11-18
Funding
Affiliations
    1.Aerospace Institute of Advanced Materials & Processing Technology, Beijing 100074, China
    2.China Building Material Test & Certification Group Co., Ltd, Beijing 100024, China
    3.State Key Laboratory of New Ceramics and Fine Processing, Tsinghua University, Beijing 100084, China
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表12种不同金属材料的力学参数
科
Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)
属
Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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