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Morphological Control and Polishing Behavior of Mesoporous Silica Particles
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Wenjie CAI, Hailiang MU, Zhaoyu MU, Yang CHEN
Journal of the Chinese Ceramic Society | 2020, 48(8) : 1333 - 1340
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Journal of the Chinese Ceramic Society | 2020, 48(8): 1333-1340
• Research Articles •
Morphological Control and Polishing Behavior of Mesoporous Silica Particles
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Wenjie CAI, Hailiang MU, Zhaoyu MU, Yang CHEN
Affiliations
  • School of Materials Science and Engineering, Changzhou University, Changzhou 213164, Jiangsu, China

    • CAI Wenjie (1993-), male, Master candidate. E-mail:

About Author:

CAI Wenjie (1993-), male, Master candidate. E-mail:

Published: 2020-08-20 doi: 10.14062/j.issn.0454-5648.20190674
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Hexagonal mesoporous silica (H-mSiO2) particles were prepared via an alcohol/water mixed reaction system using cetyltrimethyl ammonium bromide as a template. The resultant products were characterized by scanning electron microscopy, transmission electron microscopy, X-ray diffraction, Fourier transform spectroscopy, thermogravimetric analysis-differential scanning calorimetry, and nitrogen adsorption/desorption measurements. As an alcohol/water volume ratio decreases slowly, the morphologies of samples change from spherical/ellipsoidal to spherical and then to necked or peanut-like. Based on the polishing tests over oxide films (about 208 nm), the developed H-mSiO2 abrasives contribute to the reductions of surface roughness and topographical variation, compared to non-porous sphere SiO2 (sSiO2) particles. The root-mean-square roughness of oxidized silicon wafers reduces from (1.27±0.15) nm to (0.25±0.01) nm after polishing with H-mSiO2 containing spherical and ellipsoidal particles. The maximum asperity height in sectional profiles decreases from 3.59 nm to 0.72 nm, and the maximum valley depth also reduces from 3.16 nm to 0.69 nm. Moreover, H-mSiO2 abrasives with uniform spherical shapes achieve a removal rate of (223±17) nm/min.

mesoporous silica  /  morphology control  /  abrasive particle  /  polishing
蔡文杰, 穆海亮, 穆兆宇, 陈杨. 介孔氧化硅颗粒的形貌调控和抛光性能. 硅酸盐学报, 2020 , 48 (8) : 1333 -1340 . DOI: 10.14062/j.issn.0454-5648.20190674
Wenjie CAI, Hailiang MU, Zhaoyu MU, Yang CHEN. Morphological Control and Polishing Behavior of Mesoporous Silica Particles[J]. Journal of the Chinese Ceramic Society, 2020 , 48 (8) : 1333 -1340 . DOI: 10.14062/j.issn.0454-5648.20190674
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Year 2020 volume 48 Issue 8
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Article Info
doi: 10.14062/j.issn.0454-5648.20190674
  • Receive Date：2019-10-11
  • Online Date：2026-10-29
  • Published：2020-08-20
Article Data
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History
  • Received：2019-10-11
  • Revised：2020-03-02
Funding
Affiliations
    School of Materials Science and Engineering, Changzhou University, Changzhou 213164, Jiangsu, China

Corresponding:

CHEN Yang (1978-), male, Ph.D., Professor. E-mail:
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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