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Effects of Scratch Speed and Crystal Orientation on Scratch Characteristics of 6H-SiC Wafer
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Yinxia ZHANG, Pengju HUANG, Wei GAO
Journal of the Chinese Ceramic Society | 2021, 49(12) : 2644 - 2651
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Journal of the Chinese Ceramic Society | 2021, 49(12): 2644-2651
• Research Article •
Effects of Scratch Speed and Crystal Orientation on Scratch Characteristics of 6H-SiC Wafer
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Yinxia ZHANG, Pengju HUANG, Wei GAO
Affiliations
  • Henan Key Engineering Laboratory of Anti-Manufacturing Technology, School of Mechanical and Power Engineering, Zhengzhou University, Zhengzhou 450001, China

    • ZHANG Yinxia (1974-), female, Ph.D., Associate Professor. E-mail:

About Author:

ZHANG Yinxia (1974-), female, Ph.D., Associate Professor. E-mail:

Published: 2021-12-20 doi: 10.14062/j.issn.0454-5648.20210086
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Scratch tests were conducted on 6H-SiC single crystal wafers at different speeds and crystal orientations by a micron-/nano-sacle mechanical test system to analyze the friction coefficient, scratch depth of cut and surface three-dimensional morphology of the scratches. The results show that when the static load is 4 N or 6 N and the scratch speed is 0.2-1.6 mm/min, the scratch friction coefficient, scratch cutting depth and scratch width increase with the increases of load and scratch speed, and the plastic deformation area of SiC single crystal sheet increases and the surface becomes rougher. The friction coefficient is lower for low-speed scratching, thus reducing the wear rate of diamond head to some degree. The accumulation and pit degree of scratch materials at different crystal orientations are different. When the scratch crystal orientations are and , the friction coefficient, peak height and valley depth of scratch morphology are smaller, while the scratches along the and crystal orientations are larger. The former is easier to realize plastic removal than the latter.

silicon carbide wafer  /  scratch speed  /  crystal orientation  /  surface morphology
张银霞, 黄鹏举, 郜伟. 划痕速率和晶向对6H-SiC单晶片划痕特征的影响. 硅酸盐学报, 2021 , 49 (12) : 2644 -2651 . DOI: 10.14062/j.issn.0454-5648.20210086
Yinxia ZHANG, Pengju HUANG, Wei GAO. Effects of Scratch Speed and Crystal Orientation on Scratch Characteristics of 6H-SiC Wafer[J]. Journal of the Chinese Ceramic Society, 2021 , 49 (12) : 2644 -2651 . DOI: 10.14062/j.issn.0454-5648.20210086
Appendix
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Year 2021 volume 49 Issue 12
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Article Info
doi: 10.14062/j.issn.0454-5648.20210086
  • Receive Date：2021-01-29
  • Online Date：2026-10-30
  • Published：2021-12-20
Article Data
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History
  • Received：2021-01-29
  • Revised：2021-04-15
Funding
Affiliations
    Henan Key Engineering Laboratory of Anti-Manufacturing Technology, School of Mechanical and Power Engineering, Zhengzhou University, Zhengzhou 450001, China

Corresponding:

GAO Wei(1974-), male, Experimentalist. E-mail:
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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