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Effect of Sintering Aids on Thermal Conductivity and Mechanical Properties of Silicon Nitride Ceramics
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Jian LIU1, Zhipeng XIE1, Zhicai XIAO2, Yi XIAO2
Journal of the Chinese Ceramic Society | 2020, 48(12) : 1865 - 1871
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Journal of the Chinese Ceramic Society | 2020, 48(12): 1865-1871
Effect of Sintering Aids on Thermal Conductivity and Mechanical Properties of Silicon Nitride Ceramics
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Jian LIU1, Zhipeng XIE1, Zhicai XIAO2, Yi XIAO2
Affiliations
  • 1.State Key Laboratory of New Ceramics and Fine Processing, Tsinghua University, Beijing 100084, China
  • 2.Changde Kerui new material Technology Co. Ltd., Hunan, Changde 415000, Hunan, China
  • Liu Jian (1990-), male, Doctorial, candidate. E-mail:

About Author:

Liu Jian (1990-), male, Doctorial, candidate. E-mail:

Published: 2020-12-20 doi: 10.14062/j.issn.0454-5648.20200351
Outline
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β-phase high thermal conductivity silicon nitride ceramics were prepared by sintering at 1 900 ℃ for 2 h using silicon nitride (α-phase≥95%, particle size 0.5 μm) as a raw material, and MgO-Y2O3 as a composite sintering aid. The effects of sintering aid content and ratio on the densification process, thermal conductivity, mechanical properties and microstructure of silicon nitride ceramics were discussed. The results show that when the addition amount of sintering aid is 5% MgO+4% Y2O3, the thermal conductivity, bending strength, fracture toughness of the sample sintered in air at 1 890 ℃ for 2 h can reach 85.96 W·m-1·K-1, 873 MPa and 8.39 MPa·m1/2, respectively. In the sintering process, Y2O3 reacts with Si3N4 to form a compound fixed at the grain boundary, which plays a role in purifying the silicon nitride lattice and improves the thermal conductivity of the sintered sample. Excessive MgO and Y2O3 will form compounds during the sintering process and remain at the grain boundary, which will reduce the mechanical properties and thermal conductivity of the material.

silicon nitride  /  gas press sintering  /  thermal conductivity  /  mechanical properties  /  microstructure
刘剑, 谢志鹏, 肖志才, 肖毅. 烧结助剂对氮化硅陶瓷热导率和力学性能的影响. 硅酸盐学报, 2020 , 48 (12) : 1865 -1871 . DOI: 10.14062/j.issn.0454-5648.20200351
Jian LIU, Zhipeng XIE, Zhicai XIAO, Yi XIAO. Effect of Sintering Aids on Thermal Conductivity and Mechanical Properties of Silicon Nitride Ceramics[J]. Journal of the Chinese Ceramic Society, 2020 , 48 (12) : 1865 -1871 . DOI: 10.14062/j.issn.0454-5648.20200351
Year 2020 volume 48 Issue 12
30
11
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Article Info
doi: 10.14062/j.issn.0454-5648.20200351
  • Receive Date:2020-05-19
  • Online Date:2026-10-30
  • Published:2020-12-20
Article Data
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History
  • Received:2020-05-19
  • Revised:2020-05-28
Funding
Affiliations
    1.State Key Laboratory of New Ceramics and Fine Processing, Tsinghua University, Beijing 100084, China
    2.Changde Kerui new material Technology Co. Ltd., Hunan, Changde 415000, Hunan, China

Corresponding:

XIE Zhipeng (1957-), male, Ph.D., Professor.. E-mail:
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表12种不同金属材料的力学参数
科
Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)
属
Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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