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Electro-thermal Performance Optimization and Evaluation of Automotive SiC Power Module
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Rongyao MA1, 2, Kaifeng TANG2, Xiaofei PAN3, 4, Zhifeng SHAO2, Peng SUN3, Zheng ZENG3
Journal of Power Supply | 2024, 22(3) : 78 - 86
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Journal of Power Supply | 2024, 22(3): 78-86
• Packaging Design and Optimization •
Electro-thermal Performance Optimization and Evaluation of Automotive SiC Power Module
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Rongyao MA1, 2, Kaifeng TANG2, Xiaofei PAN3, 4, Zhifeng SHAO2, Peng SUN3, Zheng ZENG3
Affiliations
  • 1 School of Microelectronics and Communication Engineering Chongqing University Chongqing 400044 China
  • 2 China Resources Microelectronics (Chongqing) Limited Chongqing 401332 China
  • 3 School of Electrical Engineering Chongqing University Chongqing 400044 China
  • 4 China Resources Runan Technologies(Chongqing) Co., Ltd Chongqing 400015 China
Published: 2024-05-30 doi: 10.13234/j.issn.2095-2805.2024.3.78
Outline
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Owing to their advantages in switching speed, temperature characteristics and voltage withstand capability, silicon carbide (SiC) power modules are gradually applied in the motor controllers of electric vehicles. As a core component of electric vehicles, the motor controller demands high electro-thermal characteristics of power modules, posing a significant challenge to SiC packaging. In this paper, the mainstream HybridPACK Drive module packaging is taken as an example, the driver and direct bonded copper(DBC) layout are optimized, and the copper wire bonding technology is introduced to balance the module's electro-thermal performance and reliability. In addition, the response surface methodology is used to optimize the elliptical Pin-Fin heat sink, thereby enhancing the module's heat dissipation performance. Finally, prototypes of SiC power modules before and after optimization were fabricated for comparison, and a double-pulse test setup and a power back-to-back test setup were established respectively to evaluate the electro-thermal performance of the two approaches. Experimental results indicate that when the chip spacing was equal to half the die width, the optimized power module can achieve a superior thermal performance while maintaining the electrical characteristics.

Silicon carbide metal-oxide-semiconductor field effect transistor(SiC MOSFET)  /  copper wire interconnec-tion  /  response surface methodology  /  direct bonded copper(DBC) layout
Rongyao MA, Kaifeng TANG, Xiaofei PAN, Zhifeng SHAO, Peng SUN, Zheng ZENG. Electro-thermal Performance Optimization and Evaluation of Automotive SiC Power Module[J]. Journal of Power Supply, 2024 , 22 (3) : 78 -86 . DOI: 10.13234/j.issn.2095-2805.2024.3.78
Funding
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  • National Natural Science Foundation of China(52177169)
Appendix
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Year 2024 volume 22 Issue 3
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Article Info
doi: 10.13234/j.issn.2095-2805.2024.3.78
  • Receive Date：2024-01-31
  • Online Date：2025-07-21
  • Published：2024-05-30
Article Data
Affiliations
History
  • Received：2024-01-31
  • Revised：2024-02-29
  • Accepted：2024-03-01
Funding
National Natural Science Foundation of China(52177169)
Affiliations
    1 School of Microelectronics and Communication Engineering Chongqing University Chongqing 400044 China
    2 China Resources Microelectronics (Chongqing) Limited Chongqing 401332 China
    3 School of Electrical Engineering Chongqing University Chongqing 400044 China
    4 China Resources Runan Technologies(Chongqing) Co., Ltd Chongqing 400015 China
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