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Research and Application of Dynamic Burn in Test Technology for EEPROM Memory
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Yang LI1, Wenjie ZHANG1, Shuai SHI2, Jianbo REN1, Huanhuan GUO1
Missiles and Space Vehicles | 2025, 48(6) : 100 - 106
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Missiles and Space Vehicles | 2025, 48(6): 100-106
Environment and Test
Research and Application of Dynamic Burn in Test Technology for EEPROM Memory
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Yang LI1, Wenjie ZHANG1, Shuai SHI2, Jianbo REN1, Huanhuan GUO1
Affiliations
  • 1. Material Center of China Academy of Launch Vehicle Technology, Beijing, 100076
  • 2. China Academy of Launch Vehicle Technology, Beijing, 100076
Published: 2025-12-25 doi: 10.7654/j.issn.2097-1974.20250615
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EEPROM as a core non-volatile memory device in critical systems such as aerospace, automotive electronics, and industrial control, its long-term reliability is directly related to the data security of the equipment. Traditional static burn-in (BI) technology only use high temperature and bias voltage to accelerate failure, which is difficult to simulate the electrical stress damage under the actual dynamic working state, and the fault coverage is limited. Dynamic BI technology can effectively activate early failures by simulating real workloads, thereby improving the reliability of the device. XX28C010 device is taken as the research object. Firstly, the working principles of dynamic and static BI, device working principles and graphic algorithm are introduced, then the system architecture, test algorithm program and hardware design are introduced, and finally the test results are analyzed, which provide a reference for the research on dynamic BI technology of EEPROM.

electrically erasable programmable read-only memory  /  graphic algorithms  /  reliability  /  dynamic BI  /  static BI
Yang LI, Wenjie ZHANG, Shuai SHI, Jianbo REN, Huanhuan GUO. Research and Application of Dynamic Burn in Test Technology for EEPROM Memory[J]. Missiles and Space Vehicles, 2025 , 48 (6) : 100 -106 . DOI: 10.7654/j.issn.2097-1974.20250615
Year 2025 volume 48 Issue 6
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Article Info
doi: 10.7654/j.issn.2097-1974.20250615
  • Receive Date:2025-07-06
  • Online Date:2026-01-20
  • Published:2025-12-25
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  • Received:2025-07-06
  • Revised:2025-11-30
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    1. Material Center of China Academy of Launch Vehicle Technology, Beijing, 100076
    2. China Academy of Launch Vehicle Technology, Beijing, 100076
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表12种不同金属材料的力学参数

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Number of
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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