The third-generation semiconductor material processing equipment technology plays an important role in ensuring material performance advantages, promoting technological innovation and development, and enhancing the overall competitiveness of the third-generation semiconductor industry. Based on the Incopat database and using analysis tools such as Citespace and Excel, combined with literature research and expert consultation, this study conducted a sequential analysis of patent application trends and technology life cycle, technology source regions and market distribution, R&D institution competition situation, and hot research topic technology progress in the field of global third-generation semiconductor material processing equipment technology. Research has shown that the third-generation semiconductor material processing equipment technology has transitioned from the growth stage to the mature stage, but there is still room for innovation in sub fields such as ultrawide bandgap material processing and high-precision surface treatment. Japan and the United States are the main source regions of technology, while China has grown rapidly in the number of patent applications but lags behind in its international layout. The research hotspots focus on high-precision substrate surface treatment and planarization, precise control and uniformity improvement of epitaxial growth, and integrated and automated processing equipment manufacturing.