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Application of Evaporation Concentration Device in Uranium Plating Wastewater Treatment
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Xiaochen LIU, Xuyang CHU, Xiaochen LIU, Yuhang GAN, Qian ZHANG
Uranium Mining and Metallurgy | 2025, 44(1) : 138 - 143
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Uranium Mining and Metallurgy | 2025, 44(1): 138-143
SAFETY AND ENVIRONMENT PROTECTION
Application of Evaporation Concentration Device in Uranium Plating Wastewater Treatment
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Xiaochen LIU, Xuyang CHU, Xiaochen LIU, Yuhang GAN, Qian ZHANG
Affiliations
  • Beijing Research Institute of Chemical Engineering and Metallurgy, CNNC, Beijing 101149, China
Published: 2025-02-20 doi: 10.13426/j.cnki.yky.2024.04.17
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To address the wastewater treatment issue in electrode uranium plating process, an evaporation concentration device suitable for the special requirements of this process has been developed, which can effectively reduce the discharge of radioactive process wastewater. The principle of this device is to vaporize the water in the waste liquid through micro-vacuum distillation, condense it back into liquid water, and then discharge it externally. The remaining concentrated water and solid in the evaporator are treated as radioactive solid waste. Considering the actual application scenarios, leak-proof foundation pits are set up to address equipment failure or emergency shower problems. The device uses neutralizing tanks to handle the acidity and alkalinity of the waste liquid, and is equipped with a detection port to ensure that the waste liquid after condensation meets the emission standards.

wastewater treatment  /  uranium plating process  /  evaporation
Xiaochen LIU, Xuyang CHU, Xiaochen LIU, Yuhang GAN, Qian ZHANG. Application of Evaporation Concentration Device in Uranium Plating Wastewater Treatment[J]. Uranium Mining and Metallurgy, 2025 , 44 (1) : 138 -143 . DOI: 10.13426/j.cnki.yky.2024.04.17
Year 2025 volume 44 Issue 1
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doi: 10.13426/j.cnki.yky.2024.04.17
  • Receive Date:2024-04-28
  • Online Date:2025-07-04
  • Published:2025-02-20
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  • Received:2024-04-28
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    Beijing Research Institute of Chemical Engineering and Metallurgy, CNNC, Beijing 101149, China
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表12种不同金属材料的力学参数

Family
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Number of
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Number of
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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